Manufacturing method of anti-warping circuit board

The invention discloses and provides a manufacturing method of an anti-warping circuit board, which is reasonable in process and can effectively prevent the warping problem of a single-sided board. The manufacturing method of the anti-warping circuit board comprises the following steps of material s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG LIFA, YANG SHIDE, ZHAN SHIJING, LI WEIRONG, PAN ZIFENG, WANG GANGSHENG, ZHANG YALIN, ZHANG JING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!