Manufacturing method of anti-warping circuit board

The invention discloses and provides a manufacturing method of an anti-warping circuit board, which is reasonable in process and can effectively prevent the warping problem of a single-sided board. The manufacturing method of the anti-warping circuit board comprises the following steps of material selection, RTR material sending, RTR bearing film pasting, RAR dry film pasting, RTR exposure development, RTR etching demolding, RTR projection punching, sheet cutting, pickling passivation, top CVL pasting, top CVL pressing, first curing, sand blasting/gold immersion, bearing film unloading, bottom CVL pasting, bottom CVL pressing, character printing/second curing, first appearance punching, packaging film pasting, second appearance punching and packaging. The method is applied to the technical field of circuit board manufacturing. 本发明公开并提供了一种流程合理、能够有效防止单面板翘曲问题出现的防翘曲电路板的制造方法。本发明的防翘曲电路板的制造方法包括以下步骤：选材、RTR发料、RTR贴承载膜、RAR贴干膜、RTR曝光显影、RTR蚀刻脱膜、RTR投影打孔、分切成片、酸洗钝化、贴顶CVL、压合顶CVL、固化一、喷砂/沉金、下承载膜、贴底CVL、压合底CVL、印字符/固化二、冲外形一、贴包装胶片、冲