Cooling automotive power electronics
The present disclosure generally relates to methods and apparatus for cooling or removing heat from a power electronic module in an automobile, wherein the cooling is performed by positioning the power electronic module in a housing, introducing a fluid into the housing, and impinging the fluid onto...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure generally relates to methods and apparatus for cooling or removing heat from a power electronic module in an automobile, wherein the cooling is performed by positioning the power electronic module in a housing, introducing a fluid into the housing, and impinging the fluid onto the power electronic module and/or an electrical connection in contact with the power electronic module.
本公开总体涉及用于在汽车中冷却电力电子模块或从其去除热量的方法和装置,其中通过将电力电子模块定位在壳体中,将流体导入壳体以及将流体撞击到电力电子模块和/或与电力电子模块接触的电连接件上来执行冷却。 |
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