Patterned design for thermal management of two-phase immersed cooling systems for electronic devices

A direct chip cooling film for two-phase cooling is provided herein. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuit and having a second surface. The metal layer is located on the second surface of the dielectric layer and has a feature pattern on a side opposite to the dielectric layer. The surface pattern provides an increased surface area and a plurality of nucleation sites for two-phase cooled bubble formation. Such features may also include metal nodules to further enhance nucleation. 本文提供了一种用于两相冷却的直达芯片冷却膜。该膜包括具有用于附接到冷板或电路的第一表面并且具有第二表面的介电层。金属层位于介电层的第二表面上，在与介电层相对的一侧上具有特征图案。该表面图案为两相冷却的气泡形成提供了增加的表面积和多个成核位点。该些特征还可包括金属结核以进一步增强成核。