Silicon wafer degumming treatment method, silicon wafer degumming treatment system and silicon wafer degumming device

The embodiment of the invention provides a silicon wafer degumming processing method and system and a degumming device, and the method comprises the steps: obtaining side images of a silicon wafer and a crystal support assembly; determining the distance between the top of the silicon wafer and the bottom surface of the crystal support assembly according to the side image; and judging whether the distance meets a degumming ending condition or not, and if yes, ending degumming. According to the silicon wafer degumming treatment method, the silicon wafer degumming treatment system and the silicon wafer degumming device provided by the embodiment of the invention, the degumming condition can be automatically identified. 本申请实施例提供一种硅片脱胶处理方法、处理系统及脱胶装置，其中，方法包括：获取硅片与晶托组件的侧面图像；根据所述侧面图像确定硅片顶部与晶托组件底面之间的距离；判断所述距离是否满足脱胶结束条件，若是则结束脱胶。本申请实施例提供的硅片脱胶处理方法、处理系统及脱胶装置能够对脱胶情况进行自动识别。