Stamp hole arrangement structure for PCB and corresponding PCB forming method

The invention discloses a stamp hole arrangement structure for a PCB (Printed Circuit Board), which comprises four or six stamp holes which are arranged in sequence and are positioned close to the appearance line of the current PCB, the circle centers of the two stamp holes positioned at the head pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MO QISEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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