Manufacturing method of rigid-flex circuit board

A manufacturing method of a rigid-flex circuit board comprises the following steps: providing a double-sided copper-clad plate comprising a first copper foil, a first insulating layer and a second copper foil; circuit manufacturing is conducted on the double-face copper-clad plate, the first copper...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JOO, JIN-MIN, ZHOU XI, PENG WEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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