Copper foil improvement method
The invention provides a copper foil improvement method. The copper foil improvement method comprises the following steps: S1, selecting a copper foil raw material; s2, cutting the copper foil raw material in a dust-free environment; s3, the cut copper foil is installed on a pressing device, and cut...
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creator | SHE SHANGHUA SHI LANG XING XIAOCHAO LIAO XUHUI HUANG CHUNYAN MENG WEI |
description | The invention provides a copper foil improvement method. The copper foil improvement method comprises the following steps: S1, selecting a copper foil raw material; s2, cutting the copper foil raw material in a dust-free environment; s3, the cut copper foil is installed on a pressing device, and cutting and pressing are conducted through a concentric-square-shaped mold; s4, in the pressing process, the constant-temperature state is maintained; and S5, cooling the laminated copper foil in a natural environment, and molding the cooled copper foil. According to the copper foil improvement method provided by the invention, the copper foil raw material is cut in a dust-free environment before being pressed, so that the surface of the cut copper foil is complete and free of air attachments, the surface of the copper foil is clean and tidy in the pressing process, and constant-temperature treatment in the pressing process can effectively improve the laminating degree of pressing and enhance the pressing quality of t |
format | Patent |
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The copper foil improvement method comprises the following steps: S1, selecting a copper foil raw material; s2, cutting the copper foil raw material in a dust-free environment; s3, the cut copper foil is installed on a pressing device, and cutting and pressing are conducted through a concentric-square-shaped mold; s4, in the pressing process, the constant-temperature state is maintained; and S5, cooling the laminated copper foil in a natural environment, and molding the cooled copper foil. According to the copper foil improvement method provided by the invention, the copper foil raw material is cut in a dust-free environment before being pressed, so that the surface of the cut copper foil is complete and free of air attachments, the surface of the copper foil is clean and tidy in the pressing process, and constant-temperature treatment in the pressing process can effectively improve the laminating degree of pressing and enhance the pressing quality of t</description><language>chi ; eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220617&DB=EPODOC&CC=CN&NR=114633539A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220617&DB=EPODOC&CC=CN&NR=114633539A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHE SHANGHUA</creatorcontrib><creatorcontrib>SHI LANG</creatorcontrib><creatorcontrib>XING XIAOCHAO</creatorcontrib><creatorcontrib>LIAO XUHUI</creatorcontrib><creatorcontrib>HUANG CHUNYAN</creatorcontrib><creatorcontrib>MENG WEI</creatorcontrib><title>Copper foil improvement method</title><description>The invention provides a copper foil improvement method. 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According to the copper foil improvement method provided by the invention, the copper foil raw material is cut in a dust-free environment before being pressed, so that the surface of the cut copper foil is complete and free of air attachments, the surface of the copper foil is clean and tidy in the pressing process, and constant-temperature treatment in the pressing process can effectively improve the laminating degree of pressing and enhance the pressing quality of t</description><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBzzi8oSC1SSMvPzFHIzC0oyi9LzU3NK1HITS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhiZmxsamxpaOxsSoAQAK0CS1</recordid><startdate>20220617</startdate><enddate>20220617</enddate><creator>SHE SHANGHUA</creator><creator>SHI LANG</creator><creator>XING XIAOCHAO</creator><creator>LIAO XUHUI</creator><creator>HUANG CHUNYAN</creator><creator>MENG WEI</creator><scope>EVB</scope></search><sort><creationdate>20220617</creationdate><title>Copper foil improvement method</title><author>SHE SHANGHUA ; SHI LANG ; XING XIAOCHAO ; LIAO XUHUI ; HUANG CHUNYAN ; MENG WEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114633539A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHE SHANGHUA</creatorcontrib><creatorcontrib>SHI LANG</creatorcontrib><creatorcontrib>XING XIAOCHAO</creatorcontrib><creatorcontrib>LIAO XUHUI</creatorcontrib><creatorcontrib>HUANG CHUNYAN</creatorcontrib><creatorcontrib>MENG WEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHE SHANGHUA</au><au>SHI LANG</au><au>XING XIAOCHAO</au><au>LIAO XUHUI</au><au>HUANG CHUNYAN</au><au>MENG WEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Copper foil improvement method</title><date>2022-06-17</date><risdate>2022</risdate><abstract>The invention provides a copper foil improvement method. The copper foil improvement method comprises the following steps: S1, selecting a copper foil raw material; s2, cutting the copper foil raw material in a dust-free environment; s3, the cut copper foil is installed on a pressing device, and cutting and pressing are conducted through a concentric-square-shaped mold; s4, in the pressing process, the constant-temperature state is maintained; and S5, cooling the laminated copper foil in a natural environment, and molding the cooled copper foil. According to the copper foil improvement method provided by the invention, the copper foil raw material is cut in a dust-free environment before being pressed, so that the surface of the cut copper foil is complete and free of air attachments, the surface of the copper foil is clean and tidy in the pressing process, and constant-temperature treatment in the pressing process can effectively improve the laminating degree of pressing and enhance the pressing quality of t</abstract><oa>free_for_read</oa></addata></record> |
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subjects | LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING |
title | Copper foil improvement method |
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