High-precision organic semiconductor component preparation laminating device
The invention provides a high-precision organic semiconductor component preparation laminating device, and relates to the technical field of laminating devices.The high-precision organic semiconductor component preparation laminating device comprises a base, a mounting groove is formed in the upper...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YE JINGANG LIU DAOGUO |
| description | The invention provides a high-precision organic semiconductor component preparation laminating device, and relates to the technical field of laminating devices.The high-precision organic semiconductor component preparation laminating device comprises a base, a mounting groove is formed in the upper surface of the base, a guide rail mounting frame is mounted in the mounting groove, a guide rail is fixedly mounted on the upper surface of the guide rail mounting frame, and a concave table is arranged on one side of the guide rail; a pushing assembly is arranged on the upper surface of the base and comprises rolling wheels and a pushing block, and one side of the pushing block is fixedly installed on the surface of one end of a moving rod. As the two ends of the guide rail are triangularly arranged, the roller is preset to be not in contact with the concave table, and along with rotation of the second electric conveying belt, the roller crosses the triangular end of the guide rail, then is in rolling contact with |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114613909A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114613909A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114613909A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQgOEsDlJ9h_gABUNF6FiKpYM4uZfjesaD5i4k0ee3gg_g9P_DtzXXkf2zjomQM6tYTR6E0WYKjCrzC4smixqiCkmxq4yQoHztAoFlXfF2pjcj7czmAUum_a-VOQyXez_WFHWiHAFJqEz9zbnT2TXtse2af8wHHQw23g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High-precision organic semiconductor component preparation laminating device</title><source>esp@cenet</source><creator>YE JINGANG ; LIU DAOGUO</creator><creatorcontrib>YE JINGANG ; LIU DAOGUO</creatorcontrib><description>The invention provides a high-precision organic semiconductor component preparation laminating device, and relates to the technical field of laminating devices.The high-precision organic semiconductor component preparation laminating device comprises a base, a mounting groove is formed in the upper surface of the base, a guide rail mounting frame is mounted in the mounting groove, a guide rail is fixedly mounted on the upper surface of the guide rail mounting frame, and a concave table is arranged on one side of the guide rail; a pushing assembly is arranged on the upper surface of the base and comprises rolling wheels and a pushing block, and one side of the pushing block is fixedly installed on the surface of one end of a moving rod. As the two ends of the guide rail are triangularly arranged, the roller is preset to be not in contact with the concave table, and along with rotation of the second electric conveying belt, the roller crosses the triangular end of the guide rail, then is in rolling contact with</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220610&DB=EPODOC&CC=CN&NR=114613909A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220610&DB=EPODOC&CC=CN&NR=114613909A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YE JINGANG</creatorcontrib><creatorcontrib>LIU DAOGUO</creatorcontrib><title>High-precision organic semiconductor component preparation laminating device</title><description>The invention provides a high-precision organic semiconductor component preparation laminating device, and relates to the technical field of laminating devices.The high-precision organic semiconductor component preparation laminating device comprises a base, a mounting groove is formed in the upper surface of the base, a guide rail mounting frame is mounted in the mounting groove, a guide rail is fixedly mounted on the upper surface of the guide rail mounting frame, and a concave table is arranged on one side of the guide rail; a pushing assembly is arranged on the upper surface of the base and comprises rolling wheels and a pushing block, and one side of the pushing block is fixedly installed on the surface of one end of a moving rod. As the two ends of the guide rail are triangularly arranged, the roller is preset to be not in contact with the concave table, and along with rotation of the second electric conveying belt, the roller crosses the triangular end of the guide rail, then is in rolling contact with</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEsDlJ9h_gABUNF6FiKpYM4uZfjesaD5i4k0ee3gg_g9P_DtzXXkf2zjomQM6tYTR6E0WYKjCrzC4smixqiCkmxq4yQoHztAoFlXfF2pjcj7czmAUum_a-VOQyXez_WFHWiHAFJqEz9zbnT2TXtse2af8wHHQw23g</recordid><startdate>20220610</startdate><enddate>20220610</enddate><creator>YE JINGANG</creator><creator>LIU DAOGUO</creator><scope>EVB</scope></search><sort><creationdate>20220610</creationdate><title>High-precision organic semiconductor component preparation laminating device</title><author>YE JINGANG ; LIU DAOGUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114613909A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YE JINGANG</creatorcontrib><creatorcontrib>LIU DAOGUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YE JINGANG</au><au>LIU DAOGUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-precision organic semiconductor component preparation laminating device</title><date>2022-06-10</date><risdate>2022</risdate><abstract>The invention provides a high-precision organic semiconductor component preparation laminating device, and relates to the technical field of laminating devices.The high-precision organic semiconductor component preparation laminating device comprises a base, a mounting groove is formed in the upper surface of the base, a guide rail mounting frame is mounted in the mounting groove, a guide rail is fixedly mounted on the upper surface of the guide rail mounting frame, and a concave table is arranged on one side of the guide rail; a pushing assembly is arranged on the upper surface of the base and comprises rolling wheels and a pushing block, and one side of the pushing block is fixedly installed on the surface of one end of a moving rod. As the two ends of the guide rail are triangularly arranged, the roller is preset to be not in contact with the concave table, and along with rotation of the second electric conveying belt, the roller crosses the triangular end of the guide rail, then is in rolling contact with</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN114613909A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | High-precision organic semiconductor component preparation laminating device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T03%3A55%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YE%20JINGANG&rft.date=2022-06-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114613909A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |