Molded semiconductor package with high voltage isolation

A molded semiconductor package includes a semiconductor die attached to a substrate, the semiconductor die including a bond pad at a first side of the semiconductor die facing away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a portion of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REYNOSO DANIEL I, SCHREDL JUERGEN, RUAN YUPING, AQUITAN, ERIC, B, YANG WENYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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