Method for vertically cutting silicon rod by four lines, cutting equipment and cutting system
The embodiment of the invention provides a method for vertically cutting a silicon rod through four lines, cutting equipment and a cutting system.The method comprises the steps that S1, the silicon rod is cut once through four cutting lines in the length direction of the silicon rod, at least two of...
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| creator | HUO SHIFAN CHEN MINGYI SU GENG XUE JUNBING |
| description | The embodiment of the invention provides a method for vertically cutting a silicon rod through four lines, cutting equipment and a cutting system.The method comprises the steps that S1, the silicon rod is cut once through four cutting lines in the length direction of the silicon rod, at least two of the four cutting lines are parallel to each other, and the other cutting lines are perpendicular to all the parallel cutting lines; a first side surface is formed by cutting at least two parallel cutting lines; and S2, the silicon rod is cut once through a cutting line in the length direction of the silicon rod, and two small silicon rods with rectangular cross sections are obtained. According to the four-line vertical silicon rod cutting method, the cutting equipment and the cutting system provided by the embodiment of the invention, the silicon rod with a smaller size can be directly obtained, the silicon wafer is formed by slicing, the requirement on the small-size silicon wafer is met, and the yield can be imp |
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According to the four-line vertical silicon rod cutting method, the cutting equipment and the cutting system provided by the embodiment of the invention, the silicon rod with a smaller size can be directly obtained, the silicon wafer is formed by slicing, the requirement on the small-size silicon wafer is met, and the yield can be imp</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220607&DB=EPODOC&CC=CN&NR=114589822A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220607&DB=EPODOC&CC=CN&NR=114589822A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUO SHIFAN</creatorcontrib><creatorcontrib>CHEN MINGYI</creatorcontrib><creatorcontrib>SU GENG</creatorcontrib><creatorcontrib>XUE JUNBING</creatorcontrib><title>Method for vertically cutting silicon rod by four lines, cutting equipment and cutting system</title><description>The embodiment of the invention provides a method for vertically cutting a silicon rod through four lines, cutting equipment and a cutting system.The method comprises the steps that S1, the silicon rod is cut once through four cutting lines in the length direction of the silicon rod, at least two of the four cutting lines are parallel to each other, and the other cutting lines are perpendicular to all the parallel cutting lines; a first side surface is formed by cutting at least two parallel cutting lines; and S2, the silicon rod is cut once through a cutting line in the length direction of the silicon rod, and two small silicon rods with rectangular cross sections are obtained. According to the four-line vertical silicon rod cutting method, the cutting equipment and the cutting system provided by the embodiment of the invention, the silicon rod with a smaller size can be directly obtained, the silicon wafer is formed by slicing, the requirement on the small-size silicon wafer is met, and the yield can be imp</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj1TS3JyE9RSMsvUihLLSrJTE7MyalUSC4tKcnMS1cozszJTM7PUygCKkmqBKoqLVLIycxLLdaBK0ktLM0syE3NK1FIzEtBaKwsLknN5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYmphaWFkZGjsbEqAEAHxU8mQ</recordid><startdate>20220607</startdate><enddate>20220607</enddate><creator>HUO SHIFAN</creator><creator>CHEN MINGYI</creator><creator>SU GENG</creator><creator>XUE JUNBING</creator><scope>EVB</scope></search><sort><creationdate>20220607</creationdate><title>Method for vertically cutting silicon rod by four lines, cutting equipment and cutting system</title><author>HUO SHIFAN ; CHEN MINGYI ; SU GENG ; XUE JUNBING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114589822A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUO SHIFAN</creatorcontrib><creatorcontrib>CHEN MINGYI</creatorcontrib><creatorcontrib>SU GENG</creatorcontrib><creatorcontrib>XUE JUNBING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUO SHIFAN</au><au>CHEN MINGYI</au><au>SU GENG</au><au>XUE JUNBING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for vertically cutting silicon rod by four lines, cutting equipment and cutting system</title><date>2022-06-07</date><risdate>2022</risdate><abstract>The embodiment of the invention provides a method for vertically cutting a silicon rod through four lines, cutting equipment and a cutting system.The method comprises the steps that S1, the silicon rod is cut once through four cutting lines in the length direction of the silicon rod, at least two of the four cutting lines are parallel to each other, and the other cutting lines are perpendicular to all the parallel cutting lines; a first side surface is formed by cutting at least two parallel cutting lines; and S2, the silicon rod is cut once through a cutting line in the length direction of the silicon rod, and two small silicon rods with rectangular cross sections are obtained. According to the four-line vertical silicon rod cutting method, the cutting equipment and the cutting system provided by the embodiment of the invention, the silicon rod with a smaller size can be directly obtained, the silicon wafer is formed by slicing, the requirement on the small-size silicon wafer is met, and the yield can be imp</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | Method for vertically cutting silicon rod by four lines, cutting equipment and cutting system |
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