Target assembly, target thereof and device for processing lining

一种靶组件，其中溅射材料不是用焊接法或其它冶金方法接合于衬板(20)上的。而是以机械方式(例如用螺栓(45))将靶(30)连接于适配器(32)上，该靶(30)整个由单一的溅射材料制成，该适配器本身被永久性地固定在真空室(10)上。结果是，可以容易地从真空室上卸下和更换溅射靶，而并不需要卸下和更换衬板。 A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	P.S. GILMAN, T.J. HUNT, D.P. STRAUSS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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