Integrated electronic structures and data communication between structural components

An electronic assembly for communication between electronic chips is provided. An electronic assembly includes a mechanical support carrying at least one base block including at least two electronic chips. At least one of the electronic chips is configured as a data signaling chip with respect to at...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HALAHMI, EREZ
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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