Integrated electronic structures and data communication between structural components

Integrated electronic structures and data communication between structural components

An electronic assembly for communication between electronic chips is provided. An electronic assembly includes a mechanical support carrying at least one base block including at least two electronic chips. At least one of the electronic chips is configured as a data signaling chip with respect to at...

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1. Verfasser: HALAHMI, EREZ
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description An electronic assembly for communication between electronic chips is provided. An electronic assembly includes a mechanical support carrying at least one base block including at least two electronic chips. At least one of the electronic chips is configured as a data signaling chip with respect to at least one further electronic chip for data communication with the at least one further electronic chip, and the at least one further electronic chip is configured as a data receiving chip with respect to the data signaling chip. The data signaling chip and the data receiving chip are respectively opposed to each other by their surfaces, which are arranged in a spaced-apart relationship and together define at least one interface area. Data communication from the data signaling chip to the at least one data receiving chip is in the form of at least one charge carrier flux propagating in free space via a gap between the spaced-apart surfaces of the chips in the interface region, the at least one data receiving chip i
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Integrated electronic structures and data communication between structural components
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