Semiconductor strip cutting and sorting equipment, packaging body drying device and carrying device

The embodiment of the invention provides semiconductor strip cutting and sorting equipment, a packaging body drying device and a carrying device. The package drying apparatus according to an embodiment of the present invention is used for drying a singulated package in a semiconductor strip cutting and sorting apparatus, the package drying apparatus comprising: an overturning table which adsorbs the package and can be rotated upward or downward; a chamber disposed below the roll-over table and accommodating water vapor scattered from the package; an upper air injection unit configured to be movable in a horizontal direction inside the chamber and to inject air toward the package; and a suction unit which is disposed at the lower end of the chamber and sucks the water vapor. 本发明的实施例提供半导体条带切割及分类设备、封装体干燥装置及搬运装置。根据本发明的实施例的封装体干燥装置用于在半导体条带切割及分类设备中干燥单个化的封装体，其中，所述封装体干燥装置包括：翻转台，吸附所述封装体，并能够旋转成朝上或者朝下；腔室，配置于所述翻转台的下方而容纳从所述封装体飞散的水汽；上喷气单元，构成为在所述腔室的内部能够沿着水平方向移动，并朝向所述封装体喷射空气；以及抽吸单元，配置于所述腔室的下端而抽吸所述水汽。