Preparation method of flame-retardant epoxy/organic silicon hybrid laminated copper-clad plate
The invention relates to the technical field of functional polymer material preparation, and discloses a preparation method of a flame-retardant epoxy/organic silicon hybrid laminated board, which comprises the following steps: stirring, mixing and refluxing hydrogen-containing silane, vinyl epoxy r...
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| creator | CHEN MING LI LIANWEI ZHAN HAO NI LINGLI CAI PENG WANG LINXIANG |
| description | The invention relates to the technical field of functional polymer material preparation, and discloses a preparation method of a flame-retardant epoxy/organic silicon hybrid laminated board, which comprises the following steps: stirring, mixing and refluxing hydrogen-containing silane, vinyl epoxy resin and a chloroplatinic acid isopropanol solution to obtain epoxy group-terminated organic silicon resin; the preparation method comprises the following steps: uniformly mixing epoxy group-terminated organic silicon resin, polyfunctional epoxy resin, filler and active micromolecular epoxy resin, adding an amino-modified triazine compound curing agent, and uniformly mixing and stirring to obtain a glue solution; glass fabric is soaked in the glue solution for 1-2 min and then taken out to be dried, then the two faces of the glass fabric are covered with copper foil, and the flame-retardant epoxy/organic silicon hybrid laminated board with the two faces covered with copper is obtained through hot pressing. The acti |
| format | Patent |
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the preparation method comprises the following steps: uniformly mixing epoxy group-terminated organic silicon resin, polyfunctional epoxy resin, filler and active micromolecular epoxy resin, adding an amino-modified triazine compound curing agent, and uniformly mixing and stirring to obtain a glue solution; glass fabric is soaked in the glue solution for 1-2 min and then taken out to be dried, then the two faces of the glass fabric are covered with copper foil, and the flame-retardant epoxy/organic silicon hybrid laminated board with the two faces covered with copper is obtained through hot pressing. The acti</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Preparation method of flame-retardant epoxy/organic silicon hybrid laminated copper-clad plate |
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