Ultrasonic atomization etching method for fine circuit of PCB (Printed Circuit Board)

The invention discloses an ultrasonic atomization etching method for a fine circuit of a PCB (Printed Circuit Board). The technological process is as follows: step 1, cleaning and roughening the copper surface of a circuit board to be manufactured; 2, performing film pressing on the cleaned circuit board by using a vacuum film pressing machine; 3, exposing the circuit board subjected to film pressing by using LDI (Laser Direct Imaging) to realize circuit pattern image transfer; 4, developing the pattern; 5, the developed circuit board is etched to remove redundant copper through an ultrasonic atomization etching method; and 6, after the film is removed, showing a circuit pattern. According to the ultrasonic atomization etching method, the two-fluid nozzle is improved, and the ultrasonic vibrator is additionally arranged at the lower part of the two-fluid nozzle, so that the sprayed etching liquid medicine tends to be atomized, the atomized liquid medicine particles are only about 8-20 microns, and the manufac