School uniform with intelligent badge with built-in electronic chip

School uniform with intelligent badge with built-in electronic chip

The invention discloses a school uniform with a built-in electronic chip intelligent badge. The school uniform comprises a school uniform jacket, an upper neckline is mounted at the top end of the school uniform jacket, a second mounting head is mounted at one end of a limiting check block, a positi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: TANG KAIQUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
ACCESSORIES
HATS
HEAD COVERINGS
HEADWEAR
HUMAN NECESSITIES
OUTERWEAR
PROTECTIVE GARMENTS
WEARING APPAREL
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TANG KAIQUAN
description The invention discloses a school uniform with a built-in electronic chip intelligent badge. The school uniform comprises a school uniform jacket, an upper neckline is mounted at the top end of the school uniform jacket, a second mounting head is mounted at one end of a limiting check block, a positioning groove hole is formed in the second mounting head, and a windproof structure is arranged at one end of the upper neckline. According to the invention, the placement pocket is firstly subjected to certain installation treatment, so that the second bonding tearing layer of the placement pocket reaches the position of the first bonding tearing layer and then the corresponding bonding work is carried out, and therefore, the protection installation treatment of the chip main body of the placement pocket is completed; according to the utility model, the chip main body is not easy to fall off and the like, and meanwhile, the placement pocket is woven by the waterproof material, so that the chip main body is not dama
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114431553A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114431553A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114431553A3</originalsourceid><addsrcrecordid>eNrjZHAOTs7Iz89RKM3LTMsvylUozyzJUMjMK0nNyclMT80rUUhKTElPhQgnlWbmlOhm5imk5qQmlxTl52UmKyRnZBbwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQxMTY0NTU2NHY2LUAACNnjKC</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>School uniform with intelligent badge with built-in electronic chip</title><source>esp@cenet</source><creator>TANG KAIQUAN</creator><creatorcontrib>TANG KAIQUAN</creatorcontrib><description>The invention discloses a school uniform with a built-in electronic chip intelligent badge. The school uniform comprises a school uniform jacket, an upper neckline is mounted at the top end of the school uniform jacket, a second mounting head is mounted at one end of a limiting check block, a positioning groove hole is formed in the second mounting head, and a windproof structure is arranged at one end of the upper neckline. According to the invention, the placement pocket is firstly subjected to certain installation treatment, so that the second bonding tearing layer of the placement pocket reaches the position of the first bonding tearing layer and then the corresponding bonding work is carried out, and therefore, the protection installation treatment of the chip main body of the placement pocket is completed; according to the utility model, the chip main body is not easy to fall off and the like, and meanwhile, the placement pocket is woven by the waterproof material, so that the chip main body is not dama</description><language>chi ; eng</language><subject>ACCESSORIES ; HATS ; HEAD COVERINGS ; HEADWEAR ; HUMAN NECESSITIES ; OUTERWEAR ; PROTECTIVE GARMENTS ; WEARING APPAREL</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220506&amp;DB=EPODOC&amp;CC=CN&amp;NR=114431553A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220506&amp;DB=EPODOC&amp;CC=CN&amp;NR=114431553A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANG KAIQUAN</creatorcontrib><title>School uniform with intelligent badge with built-in electronic chip</title><description>The invention discloses a school uniform with a built-in electronic chip intelligent badge. The school uniform comprises a school uniform jacket, an upper neckline is mounted at the top end of the school uniform jacket, a second mounting head is mounted at one end of a limiting check block, a positioning groove hole is formed in the second mounting head, and a windproof structure is arranged at one end of the upper neckline. According to the invention, the placement pocket is firstly subjected to certain installation treatment, so that the second bonding tearing layer of the placement pocket reaches the position of the first bonding tearing layer and then the corresponding bonding work is carried out, and therefore, the protection installation treatment of the chip main body of the placement pocket is completed; according to the utility model, the chip main body is not easy to fall off and the like, and meanwhile, the placement pocket is woven by the waterproof material, so that the chip main body is not dama</description><subject>ACCESSORIES</subject><subject>HATS</subject><subject>HEAD COVERINGS</subject><subject>HEADWEAR</subject><subject>HUMAN NECESSITIES</subject><subject>OUTERWEAR</subject><subject>PROTECTIVE GARMENTS</subject><subject>WEARING APPAREL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOTs7Iz89RKM3LTMsvylUozyzJUMjMK0nNyclMT80rUUhKTElPhQgnlWbmlOhm5imk5qQmlxTl52UmKyRnZBbwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQxMTY0NTU2NHY2LUAACNnjKC</recordid><startdate>20220506</startdate><enddate>20220506</enddate><creator>TANG KAIQUAN</creator><scope>EVB</scope></search><sort><creationdate>20220506</creationdate><title>School uniform with intelligent badge with built-in electronic chip</title><author>TANG KAIQUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114431553A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ACCESSORIES</topic><topic>HATS</topic><topic>HEAD COVERINGS</topic><topic>HEADWEAR</topic><topic>HUMAN NECESSITIES</topic><topic>OUTERWEAR</topic><topic>PROTECTIVE GARMENTS</topic><topic>WEARING APPAREL</topic><toplevel>online_resources</toplevel><creatorcontrib>TANG KAIQUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANG KAIQUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>School uniform with intelligent badge with built-in electronic chip</title><date>2022-05-06</date><risdate>2022</risdate><abstract>The invention discloses a school uniform with a built-in electronic chip intelligent badge. The school uniform comprises a school uniform jacket, an upper neckline is mounted at the top end of the school uniform jacket, a second mounting head is mounted at one end of a limiting check block, a positioning groove hole is formed in the second mounting head, and a windproof structure is arranged at one end of the upper neckline. According to the invention, the placement pocket is firstly subjected to certain installation treatment, so that the second bonding tearing layer of the placement pocket reaches the position of the first bonding tearing layer and then the corresponding bonding work is carried out, and therefore, the protection installation treatment of the chip main body of the placement pocket is completed; according to the utility model, the chip main body is not easy to fall off and the like, and meanwhile, the placement pocket is woven by the waterproof material, so that the chip main body is not dama</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN114431553A
source esp@cenet
subjects ACCESSORIES
HATS
HEAD COVERINGS
HEADWEAR
HUMAN NECESSITIES
OUTERWEAR
PROTECTIVE GARMENTS
WEARING APPAREL
title School uniform with intelligent badge with built-in electronic chip
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T06%3A09%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TANG%20KAIQUAN&rft.date=2022-05-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114431553A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true