Height-adjustable bonding device and working method thereof
The invention discloses a height-adjustable bonding device and a working method thereof. The bonding device comprises a bottom plate; the air cylinder fixing plate is used for mounting a jacking air cylinder and is fixedly mounted on the bottom plate through a supporting column; the vacuum adsorptio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a height-adjustable bonding device and a working method thereof. The bonding device comprises a bottom plate; the air cylinder fixing plate is used for mounting a jacking air cylinder and is fixedly mounted on the bottom plate through a supporting column; the vacuum adsorption sinking table is fixedly mounted on the bottom plate through a guide shaft; the lifting plate is located below the air cylinder fixing plate, the bottom of the lifting plate is connected with the output end of the jacking air cylinder through a connecting piece, and the lifting plate is driven by the jacking air cylinder to reciprocate up and down along the guide shafts; the conveying belt line is fixedly mounted on the lifting plate; the transportation carrier is driven by the conveying belt to translate in the conveying direction of the conveying belt; the pressing plate is erected above the conveying belt line, and the pressing plate is fixedly installed on the lifting plate through a pressing plate installati |
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