High-porosity and high-modulus polishing layer, preparation method thereof, polishing pad and application of polishing pad

High-porosity and high-modulus polishing layer, preparation method thereof, polishing pad and application of polishing pad

The invention discloses a high-porosity and high-modulus polishing layer, a preparation method of the high-porosity and high-modulus polishing layer, a polishing pad and application of the polishing pad. The high-porosity and high-modulus polishing layer is a thermosetting polyurethane polishing lay...

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Hauptverfasser: WANG JIE, LIU JIAN, YUAN LIGUANG, YANG XIAONIU, XIAO LIANGFENG, WU ZEJIA, CHU HUIYING
Format: Patent
Sprache:chi ; eng
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DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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creator WANG JIE
LIU JIAN
YUAN LIGUANG
YANG XIAONIU
XIAO LIANGFENG
WU ZEJIA
CHU HUIYING
description The invention discloses a high-porosity and high-modulus polishing layer, a preparation method of the high-porosity and high-modulus polishing layer, a polishing pad and application of the polishing pad. The high-porosity and high-modulus polishing layer is a thermosetting polyurethane polishing layer and has a rich pore structure, the pore structure comprises large pores and small pores and shows the characteristics of high energy storage modulus and low density, the energy storage modulus at the temperature of 25 DEG C is 50-250 MPa, the hardness and modulus of the high-porosity polishing pad can be improved, and the service life of the polishing pad is prolonged. The problems that the high-porosity polishing pad is poor in wear resistance, low in removal rate and poor in flatness are effectively solved. According to the preparation method, the preparation process of wet phase separation and then cross-linking curing is adopted, the thermosetting polyurethane polishing layer is formed, and unification of hi
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title High-porosity and high-modulus polishing layer, preparation method thereof, polishing pad and application of polishing pad
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