Bone voiceprint sensor and electronic equipment
The invention discloses a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor comprises a substrate; the shell is arranged on the substrate, and a containing cavity is defined by the shell and the substrate; the vibration pick-up assembly is arranged on the base plate, and th...
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| creator | DUANMU LUYU YAN TANGLIU TIAN JUNYU |
| description | The invention discloses a bone voiceprint sensor and electronic equipment. The bone voiceprint sensor comprises a substrate; the shell is arranged on the substrate, and a containing cavity is defined by the shell and the substrate; the vibration pick-up assembly is arranged on the base plate, and the vibration pick-up assembly is located in the containing cavity; the MEMS chip is arranged on the vibration pickup assembly, the MEMS chip is located in the containing cavity, and a vibration pickup cavity is defined by the MEMS chip, the vibration pickup assembly and the substrate; the supporting plate is arranged on the substrate, the supporting plate is located in the containing cavity, and a part of the supporting plate is located above the MEMS chip; and the ASIC chip is arranged on the supporting plate, the ASIC chip is located in the containing cavity, and the ASIC chip corresponds to the MEMS chip. According to the bone voiceprint sensor, the MEMS chip and the ASIC chip are stacked up and down, the size of |
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The bone voiceprint sensor comprises a substrate; the shell is arranged on the substrate, and a containing cavity is defined by the shell and the substrate; the vibration pick-up assembly is arranged on the base plate, and the vibration pick-up assembly is located in the containing cavity; the MEMS chip is arranged on the vibration pickup assembly, the MEMS chip is located in the containing cavity, and a vibration pickup cavity is defined by the MEMS chip, the vibration pickup assembly and the substrate; the supporting plate is arranged on the substrate, the supporting plate is located in the containing cavity, and a part of the supporting plate is located above the MEMS chip; and the ASIC chip is arranged on the supporting plate, the ASIC chip is located in the containing cavity, and the ASIC chip corresponds to the MEMS chip. 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The bone voiceprint sensor comprises a substrate; the shell is arranged on the substrate, and a containing cavity is defined by the shell and the substrate; the vibration pick-up assembly is arranged on the base plate, and the vibration pick-up assembly is located in the containing cavity; the MEMS chip is arranged on the vibration pickup assembly, the MEMS chip is located in the containing cavity, and a vibration pickup cavity is defined by the MEMS chip, the vibration pickup assembly and the substrate; the supporting plate is arranged on the substrate, the supporting plate is located in the containing cavity, and a part of the supporting plate is located above the MEMS chip; and the ASIC chip is arranged on the supporting plate, the ASIC chip is located in the containing cavity, and the ASIC chip corresponds to the MEMS chip. 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| language | chi ; eng |
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| subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS |
| title | Bone voiceprint sensor and electronic equipment |
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