Power amplifier chip and communication device

The embodiment of the invention provides a power amplifier chip and communication equipment. The power amplifier chip comprises a packaging shell; a plurality of power amplifier bare chips, wherein the plurality of power amplifier bare chips are sealed in the packaging shell; wherein each power amplifier bare chip in the plurality of power amplifier bare chips comprises at least one stage of power amplifier, so that the layout area, occupied by the power amplifier, of the terminal equipment can be reduced, the layout area, occupied by the communication equipment, of the terminal equipment is further reduced, and implementation of the highly integrated terminal equipment is facilitated. 本申请实施例提供了一种功率放大器芯片和通信设备，该功率放大器芯片包括：封装壳；多个功率放大器裸芯片，该多个功率放大器裸芯片合封于封装壳中；其中，该多个功率放大器裸芯片中的每一个功率放大器裸芯片包括至少一级功率放大器，从而可以降低功率放大器所占用的终端设备的版图面积，进而降低通信设备所占用的终端设备的版图面积，有利于高度集成化的终端设备的实现。