Middle frame and electronic equipment
The invention provides a middle frame and electronic equipment. Relates to the technical field of electronic equipment. The middle frame comprises a composite material body, and the composite material body comprises a metal matrix and a reinforcing body. Wherein the plurality of reinforcement bodies...
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| creator | HUANG YU WANG RONG LIU JIAJU LI FENYING CHEN QIU JIN LINFANG |
| description | The invention provides a middle frame and electronic equipment. Relates to the technical field of electronic equipment. The middle frame comprises a composite material body, and the composite material body comprises a metal matrix and a reinforcing body. Wherein the plurality of reinforcement bodies are distributed in the metal matrix. In addition, the heat conductivity coefficient of the reinforcing body is larger than that of the metal base body, and therefore component design of the reinforcing body can be carried out according to the specific heat conduction requirement of the middle frame. According to the middle frame provided by the embodiment of the invention, the reinforcing body with a relatively large heat conductivity coefficient is added into the metal matrix, so that the thickness of the middle frame is prevented from being increased while the heat-conducting property of the middle frame is effectively improved, and the light and thin design of the middle frame is favorably realized.
本申请提供了一种中框及 |
| format | Patent |
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本申请提供了一种中框及</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1zUxJyUlVSCtKzE1VSMxLUUjNSU0uKcrPy0xWSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYmxuamhsYGjsbEqAEAMGsnCw</recordid><startdate>20220419</startdate><enddate>20220419</enddate><creator>HUANG YU</creator><creator>WANG RONG</creator><creator>LIU JIAJU</creator><creator>LI FENYING</creator><creator>CHEN QIU</creator><creator>JIN LINFANG</creator><scope>EVB</scope></search><sort><creationdate>20220419</creationdate><title>Middle frame and electronic equipment</title><author>HUANG YU ; WANG RONG ; LIU JIAJU ; LI FENYING ; CHEN QIU ; JIN LINFANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114375130A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG YU</creatorcontrib><creatorcontrib>WANG RONG</creatorcontrib><creatorcontrib>LIU JIAJU</creatorcontrib><creatorcontrib>LI FENYING</creatorcontrib><creatorcontrib>CHEN QIU</creatorcontrib><creatorcontrib>JIN LINFANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG YU</au><au>WANG RONG</au><au>LIU JIAJU</au><au>LI FENYING</au><au>CHEN QIU</au><au>JIN LINFANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Middle frame and electronic equipment</title><date>2022-04-19</date><risdate>2022</risdate><abstract>The invention provides a middle frame and electronic equipment. Relates to the technical field of electronic equipment. The middle frame comprises a composite material body, and the composite material body comprises a metal matrix and a reinforcing body. Wherein the plurality of reinforcement bodies are distributed in the metal matrix. In addition, the heat conductivity coefficient of the reinforcing body is larger than that of the metal base body, and therefore component design of the reinforcing body can be carried out according to the specific heat conduction requirement of the middle frame. According to the middle frame provided by the embodiment of the invention, the reinforcing body with a relatively large heat conductivity coefficient is added into the metal matrix, so that the thickness of the middle frame is prevented from being increased while the heat-conducting property of the middle frame is effectively improved, and the light and thin design of the middle frame is favorably realized.
本申请提供了一种中框及</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Middle frame and electronic equipment |
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