Heat dissipation module applied to deep sea high-power electronic device

The invention discloses a heat dissipation module applied to a deep sea high-power electronic device. The heat dissipation module comprises a supporting protection piece, resin adhesive, the high-power electronic device, a heat conduction material and a heat dissipation substrate. The supporting protection piece is columnar, the upper end of the supporting protection piece is open, a cavity is formed in the supporting protection piece, the heat dissipation substrate is located in the center of the supporting protection piece, and a vertical through hole is formed in the heat dissipation substrate to form a seawater flow channel; the high-power electronic device is fixed on the side wall surface of the heat dissipation substrate, and a heat conduction material is filled between the high-power electronic device and the heat dissipation substrate; a cavity between the supporting protection piece and the heat dissipation substrate is filled with resin adhesive, and the high-power electronic device is covered and