Phenolic resin, curable resin composition, and cured product thereof

The present invention addresses the problem of providing a phenolic resin, a composition, and a cured product thereof, which have excellent fluidity and excellent balance of thermal modulus, low hygroscopicity, and dielectric properties of a cured product thereof, and which can be suitably used in s...

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Bibliographische Detailangaben
1. Verfasser:	HIROTA YOUSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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