Phenolic resin, curable resin composition, and cured product thereof
The present invention addresses the problem of providing a phenolic resin, a composition, and a cured product thereof, which have excellent fluidity and excellent balance of thermal modulus, low hygroscopicity, and dielectric properties of a cured product thereof, and which can be suitably used in s...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HIROTA YOUSUKE |
| description | The present invention addresses the problem of providing a phenolic resin, a composition, and a cured product thereof, which have excellent fluidity and excellent balance of thermal modulus, low hygroscopicity, and dielectric properties of a cured product thereof, and which can be suitably used in semiconductor sealing materials and the like. A reaction product of a monohydric phenol compound and an aromatic carboxylic acid having a hydroxyl group, the reaction product being characterized in that the total peak area of an ester compound represented by formula (1) and a ketone compound represented by formula (2) in GPC measurement is 70-99%. (In the formula, each of R1-R17 independently represents a hydrogen atom, an alkyl group having 1-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms. )
本发明的课题在于，提供：流动性优异、且固化物的热时模量、低吸湿性、介电特性的均衡性优异、能适合用于半导体封装材料等的酚醛树脂、组合物、和其固化物，本发明提供一种酚醛树脂，其特征在于，其为一元酚化合物与具有羟基的芳香族羧酸的反应物，GPC测定中下述式(1)所示的酯化合物与下述式(2)所示的酮化合物(2)的总计的峰面积为70～99％。(式中，R1～R17各自独立地为氢原子、碳原子数1～4的烷基或碳原子数1～4的烷氧基。) |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114341227A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114341227A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114341227A3</originalsourceid><addsrcrecordid>eNrjZHAJyEjNy8_JTFYoSi3OzNNRSC4tSkzKSYVwFZLzcwvyizNLMvOBUol5KSDp1BSFgqL8lNLkEoWSjNSi1Pw0HgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGhibGJoZGTuaEyMGgCoXTKv</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Phenolic resin, curable resin composition, and cured product thereof</title><source>esp@cenet</source><creator>HIROTA YOUSUKE</creator><creatorcontrib>HIROTA YOUSUKE</creatorcontrib><description>The present invention addresses the problem of providing a phenolic resin, a composition, and a cured product thereof, which have excellent fluidity and excellent balance of thermal modulus, low hygroscopicity, and dielectric properties of a cured product thereof, and which can be suitably used in semiconductor sealing materials and the like. A reaction product of a monohydric phenol compound and an aromatic carboxylic acid having a hydroxyl group, the reaction product being characterized in that the total peak area of an ester compound represented by formula (1) and a ketone compound represented by formula (2) in GPC measurement is 70-99%. (In the formula, each of R1-R17 independently represents a hydrogen atom, an alkyl group having 1-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms. )
本发明的课题在于，提供：流动性优异、且固化物的热时模量、低吸湿性、介电特性的均衡性优异、能适合用于半导体封装材料等的酚醛树脂、组合物、和其固化物，本发明提供一种酚醛树脂，其特征在于，其为一元酚化合物与具有羟基的芳香族羧酸的反应物，GPC测定中下述式(1)所示的酯化合物与下述式(2)所示的酮化合物(2)的总计的峰面积为70～99％。(式中，R1～R17各自独立地为氢原子、碳原子数1～4的烷基或碳原子数1～4的烷氧基。)</description><language>chi ; eng</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC CHEMISTRY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220412&DB=EPODOC&CC=CN&NR=114341227A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220412&DB=EPODOC&CC=CN&NR=114341227A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIROTA YOUSUKE</creatorcontrib><title>Phenolic resin, curable resin composition, and cured product thereof</title><description>The present invention addresses the problem of providing a phenolic resin, a composition, and a cured product thereof, which have excellent fluidity and excellent balance of thermal modulus, low hygroscopicity, and dielectric properties of a cured product thereof, and which can be suitably used in semiconductor sealing materials and the like. A reaction product of a monohydric phenol compound and an aromatic carboxylic acid having a hydroxyl group, the reaction product being characterized in that the total peak area of an ester compound represented by formula (1) and a ketone compound represented by formula (2) in GPC measurement is 70-99%. (In the formula, each of R1-R17 independently represents a hydrogen atom, an alkyl group having 1-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms. )
本发明的课题在于，提供：流动性优异、且固化物的热时模量、低吸湿性、介电特性的均衡性优异、能适合用于半导体封装材料等的酚醛树脂、组合物、和其固化物，本发明提供一种酚醛树脂，其特征在于，其为一元酚化合物与具有羟基的芳香族羧酸的反应物，GPC测定中下述式(1)所示的酯化合物与下述式(2)所示的酮化合物(2)的总计的峰面积为70～99％。(式中，R1～R17各自独立地为氢原子、碳原子数1～4的烷基或碳原子数1～4的烷氧基。)</description><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJyEjNy8_JTFYoSi3OzNNRSC4tSkzKSYVwFZLzcwvyizNLMvOBUol5KSDp1BSFgqL8lNLkEoWSjNSi1Pw0HgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGhibGJoZGTuaEyMGgCoXTKv</recordid><startdate>20220412</startdate><enddate>20220412</enddate><creator>HIROTA YOUSUKE</creator><scope>EVB</scope></search><sort><creationdate>20220412</creationdate><title>Phenolic resin, curable resin composition, and cured product thereof</title><author>HIROTA YOUSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114341227A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ACYCLIC OR CARBOCYCLIC COMPOUNDS</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HIROTA YOUSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIROTA YOUSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Phenolic resin, curable resin composition, and cured product thereof</title><date>2022-04-12</date><risdate>2022</risdate><abstract>The present invention addresses the problem of providing a phenolic resin, a composition, and a cured product thereof, which have excellent fluidity and excellent balance of thermal modulus, low hygroscopicity, and dielectric properties of a cured product thereof, and which can be suitably used in semiconductor sealing materials and the like. A reaction product of a monohydric phenol compound and an aromatic carboxylic acid having a hydroxyl group, the reaction product being characterized in that the total peak area of an ester compound represented by formula (1) and a ketone compound represented by formula (2) in GPC measurement is 70-99%. (In the formula, each of R1-R17 independently represents a hydrogen atom, an alkyl group having 1-4 carbon atoms, or an alkoxy group having 1-4 carbon atoms. )
本发明的课题在于，提供：流动性优异、且固化物的热时模量、低吸湿性、介电特性的均衡性优异、能适合用于半导体封装材料等的酚醛树脂、组合物、和其固化物，本发明提供一种酚醛树脂，其特征在于，其为一元酚化合物与具有羟基的芳香族羧酸的反应物，GPC测定中下述式(1)所示的酯化合物与下述式(2)所示的酮化合物(2)的总计的峰面积为70～99％。(式中，R1～R17各自独立地为氢原子、碳原子数1～4的烷基或碳原子数1～4的烷氧基。)</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN114341227A |
| source | esp@cenet |
| subjects | ACYCLIC OR CARBOCYCLIC COMPOUNDS AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Phenolic resin, curable resin composition, and cured product thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T05%3A53%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIROTA%20YOUSUKE&rft.date=2022-04-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114341227A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |