Method of making high density interconnected printed circuit boards with micro-vias filled with copper

The present invention relates to a method of preparing a high density interconnect printed circuit board (HDI PCB) containing micro-vias filled with copper. The method comprises the steps of: a1) providing a multi-layer substrate comprising (i) a stacked assembly of conductive interlayers embedded b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OZKOK AHMET, KIM SEIYON, REYNTS BART, SCHION THOMAS, CROBBS MATTHEW, MILKOVIC MILAN, BR ¨ 1 GGEMANN, HELMUT, BERTHOLD, HANS, J
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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