SYSTEM AND METHOD FOR CLOSED PLATING CHAMBER

The invention relates to a system and method for closing a plating chamber. Systems and methods for automated electroplating are disclosed. An electroplating system includes a first chamber configured to receive one or more components. The first chamber includes a reservoir extending from a first end to a second end, a first cap adjacent the first end, a first cathode contact coupled to the first end, a second cathode contact coupled to the second end, and a plurality of anodes formed on an inner surface of the reservoir. The electroplating system also includes at least one reservoir and first and second conduits each coupled between the at least one reservoir and the first chamber. The first conduit may be configured to transfer fluid from the first reservoir to the first chamber, and the second conduit may be configured to transfer fluid from the first chamber to the at least one reservoir. 本发明题为"用于封闭电镀室的系统和方法"。本发明公开了用于自动化电镀的系统和方法。一种电镀系统包括被构造成接纳一个或多个部件的第一室。该第一室包括从第一端部延伸到第二端部的贮器、邻近第一端部的第一顶盖、联接到第一端部的第一阴极触点、联接