Stepped coaxial MIL PTHS for adjusting inductance in package

Embodiments disclosed herein include electronic packages having embedded inductors and methods of forming such electronic packages. In an embodiment, an electronic package includes a package core and a plated through hole (PTH) through a thickness of the package core. In an embodiment, the electroni...

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Bibliographische Detailangaben
Hauptverfasser: IBRAHIM TAHER A, MARIN BRANDON C, HARIRI HAIFA, BHARATH KRISHNA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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