Stepped coaxial MIL PTHS for adjusting inductance in package

Embodiments disclosed herein include electronic packages having embedded inductors and methods of forming such electronic packages. In an embodiment, an electronic package includes a package core and a plated through hole (PTH) through a thickness of the package core. In an embodiment, the electronic package also has a magnetic housing surrounding the periphery of the PTH, where the height of the magnetic housing is less than the thickness of the package core. In an embodiment, the magnetic housing includes a substantially vertical sidewall and a tapered bottom surface. 本文公开的实施例包括具有嵌入式电感器的电子封装和形成这种电子封装的方法。在实施例中，电子封装包括封装芯和穿过封装芯的厚度的镀覆通孔(PTH)。在实施例中，电子封装还具有围绕PTH的周边的磁性外壳，其中磁性外壳的高度小于封装芯的厚度。在实施例中，磁性外壳包括基本上垂直的侧壁和锥形的底表面。