Backboard transfer detection equipment for high-density interconnection printed circuit board

Backboard transfer detection equipment for high-density interconnection printed circuit board

The invention discloses back plate transfer detection equipment for a high-density interconnected printed circuit board. The back plate transfer detection equipment comprises a back plate suction device, a back plate feeding device, a back plate displacement device, a back plate detection device I,...

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Hauptverfasser: LU CHAOMING, ZHANG BUBU
Format: Patent
Sprache:chi ; eng
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INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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creator LU CHAOMING
ZHANG BUBU
description The invention discloses back plate transfer detection equipment for a high-density interconnected printed circuit board. The back plate transfer detection equipment comprises a back plate suction device, a back plate feeding device, a back plate displacement device, a back plate detection device I, a back plate detection device II and a back plate receiving device, the backboard suction device is installed at the top end of the working frame, the backboard feeding device is installed on the feeding machine table, the backboard displacement device is installed on the right side of the working bottom table, and the first backboard detection device and the second backboard detection device are sequentially installed in the middle of the working bottom table. The back plate detection device I and the back plate detection device II are used for detecting the upper surface and the lower surface of a back plate respectively, and the back plate receiving device is mounted on the left side of the working bottom table
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114235833A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114235833A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114235833A3</originalsourceid><addsrcrecordid>eNqNjDEOwjAMALMwIOAP5gEdSkBihQrExMSKqpA4rQU4wXEHfo9AfQDTSafTTc117_z9lpwEUHFcIgoEVPRKiQFfA-UnskJMAj11fRWQC-kbiBXFJ-YxzfI1ATyJH0jh95ybSXSPgouRM7M8Hi7NqcKcWizZeWTUtjnX9XplN1trd_af5gN24j0s</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Backboard transfer detection equipment for high-density interconnection printed circuit board</title><source>esp@cenet</source><creator>LU CHAOMING ; ZHANG BUBU</creator><creatorcontrib>LU CHAOMING ; ZHANG BUBU</creatorcontrib><description>The invention discloses back plate transfer detection equipment for a high-density interconnected printed circuit board. The back plate transfer detection equipment comprises a back plate suction device, a back plate feeding device, a back plate displacement device, a back plate detection device I, a back plate detection device II and a back plate receiving device, the backboard suction device is installed at the top end of the working frame, the backboard feeding device is installed on the feeding machine table, the backboard displacement device is installed on the right side of the working bottom table, and the first backboard detection device and the second backboard detection device are sequentially installed in the middle of the working bottom table. The back plate detection device I and the back plate detection device II are used for detecting the upper surface and the lower surface of a back plate respectively, and the back plate receiving device is mounted on the left side of the working bottom table</description><language>chi ; eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220325&amp;DB=EPODOC&amp;CC=CN&amp;NR=114235833A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220325&amp;DB=EPODOC&amp;CC=CN&amp;NR=114235833A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU CHAOMING</creatorcontrib><creatorcontrib>ZHANG BUBU</creatorcontrib><title>Backboard transfer detection equipment for high-density interconnection printed circuit board</title><description>The invention discloses back plate transfer detection equipment for a high-density interconnected printed circuit board. The back plate transfer detection equipment comprises a back plate suction device, a back plate feeding device, a back plate displacement device, a back plate detection device I, a back plate detection device II and a back plate receiving device, the backboard suction device is installed at the top end of the working frame, the backboard feeding device is installed on the feeding machine table, the backboard displacement device is installed on the right side of the working bottom table, and the first backboard detection device and the second backboard detection device are sequentially installed in the middle of the working bottom table. The back plate detection device I and the back plate detection device II are used for detecting the upper surface and the lower surface of a back plate respectively, and the back plate receiving device is mounted on the left side of the working bottom table</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEOwjAMALMwIOAP5gEdSkBihQrExMSKqpA4rQU4wXEHfo9AfQDTSafTTc117_z9lpwEUHFcIgoEVPRKiQFfA-UnskJMAj11fRWQC-kbiBXFJ-YxzfI1ATyJH0jh95ybSXSPgouRM7M8Hi7NqcKcWizZeWTUtjnX9XplN1trd_af5gN24j0s</recordid><startdate>20220325</startdate><enddate>20220325</enddate><creator>LU CHAOMING</creator><creator>ZHANG BUBU</creator><scope>EVB</scope></search><sort><creationdate>20220325</creationdate><title>Backboard transfer detection equipment for high-density interconnection printed circuit board</title><author>LU CHAOMING ; ZHANG BUBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114235833A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LU CHAOMING</creatorcontrib><creatorcontrib>ZHANG BUBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU CHAOMING</au><au>ZHANG BUBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Backboard transfer detection equipment for high-density interconnection printed circuit board</title><date>2022-03-25</date><risdate>2022</risdate><abstract>The invention discloses back plate transfer detection equipment for a high-density interconnected printed circuit board. The back plate transfer detection equipment comprises a back plate suction device, a back plate feeding device, a back plate displacement device, a back plate detection device I, a back plate detection device II and a back plate receiving device, the backboard suction device is installed at the top end of the working frame, the backboard feeding device is installed on the feeding machine table, the backboard displacement device is installed on the right side of the working bottom table, and the first backboard detection device and the second backboard detection device are sequentially installed in the middle of the working bottom table. The back plate detection device I and the back plate detection device II are used for detecting the upper surface and the lower surface of a back plate respectively, and the back plate receiving device is mounted on the left side of the working bottom table</abstract><oa>free_for_read</oa></addata></record>
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Backboard transfer detection equipment for high-density interconnection printed circuit board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T10%3A00%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LU%20CHAOMING&rft.date=2022-03-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114235833A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true