Polyolefin adhesive composition

The present application provides an adhesive composition having high adhesion to a non-polar resin base material such as a liquid crystal polymer and a metal base material, solder heat resistance, low dielectric properties, and excellent pot life. The adhesive composition contains an acid-modified polyolefin (A) satisfying the following requirements (1)-(3), and further contains one or more compounds selected from the group consisting of an epoxy resin (B1), an isocyanate compound (B2), and a carbodiimide compound (B3). (1) The acid value is 5-50 mgKOH/g, (2) the bonding ratio (molar ratio) of the carboxylic acid anhydride group to the carboxylic acid group is 100/0-50/50, and (3) the total amount of the carboxylic acid anhydride group and the carboxylic acid group is 90 mol% or more when the total acid component bonded to the acid-modified polyolefin (A) is taken as 100 mol%. 本申请提供一种粘接剂组合物，其具有与如液晶聚合物的非极性的树脂基材及金属基材的高粘接性、焊锡耐热性、低介电特性，且适用期性也优异。一种粘接剂组合物，包含满足下述(1)～(3)的酸改性聚烯烃(A)，并进一步包含选自由环氧树脂(B1)、异氰酸酯化合物(B2)及碳二亚胺化合