Large-current semiconductor power device beneficial to welding

The invention discloses a large-current semiconductor power device beneficial to welding, which structurally comprises a semiconductor body, pins and a marking groove, the marking groove is arranged on the semiconductor body and fixedly connected with the semiconductor body, the pins are arranged on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: LIN CHAOFENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a large-current semiconductor power device beneficial to welding, which structurally comprises a semiconductor body, pins and a marking groove, the marking groove is arranged on the semiconductor body and fixedly connected with the semiconductor body, the pins are arranged on two sides of the semiconductor body and connected with the semiconductor body, and the marking groove is arranged in the marking groove. The semiconductor body is provided with a dense rubber block, a power element, a heat dissipation block, a heat insulation block and a processor, the dense rubber block is provided with the power element, the power element is movably clamped with the dense rubber block, the dense rubber block is provided with the heat dissipation block, and the heat dissipation block is in clearance fit with the dense rubber block. The support structure between the pin and the device shell is added, the pin is not easy to bend, and the assembly structure in the support can consume energy through