Method for manufacturing floating gate TiN film of ultra-flash memory

The invention discloses a method for manufacturing a floating gate TiN film of an ultra-flash memory, which comprises the following steps of: completing a preorder process according to the prior art until groove etching is completed; transferring to HK FOUP, and depositing TiN; depositing an oxide l...

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Hauptverfasser: WEN HAIDONG, GAO HAIXIA
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creator WEN HAIDONG
GAO HAIXIA
description The invention discloses a method for manufacturing a floating gate TiN film of an ultra-flash memory, which comprises the following steps of: completing a preorder process according to the prior art until groove etching is completed; transferring to HK FOUP, and depositing TiN; depositing an oxide layer, and wrapping TiN; wafer back cleaning is transferred to HL FOUP; photoetching to define a protection region and a non-protection region, forming a protection layer to protect the protection region, and exposing the non-protection region; turning to HK FOUP, etching to remove the oxide layer in the non-protection region, and exposing the TiN in the non-protection region; removing the protection layer of the protection area; etching to remove TiN in a non-protection region; depositing an oxide layer, and wrapping TiN of the protection area; etching to remove the oxide layer at the top of the protection region and the bottom of the groove to form an oxide layer side wall; and etching to remove the TiN at the top
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114121633A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114121633A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114121633A3</originalsourceid><addsrcrecordid>eNrjZHD1TS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSMvJTywBMdITS1IVQjL9FNIyc3IV8tMUSnNKihJ103ISizMUclNz84sqeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGJoZGhmbGxozExagDOJzLN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for manufacturing floating gate TiN film of ultra-flash memory</title><source>esp@cenet</source><creator>WEN HAIDONG ; GAO HAIXIA</creator><creatorcontrib>WEN HAIDONG ; GAO HAIXIA</creatorcontrib><description>The invention discloses a method for manufacturing a floating gate TiN film of an ultra-flash memory, which comprises the following steps of: completing a preorder process according to the prior art until groove etching is completed; transferring to HK FOUP, and depositing TiN; depositing an oxide layer, and wrapping TiN; wafer back cleaning is transferred to HL FOUP; photoetching to define a protection region and a non-protection region, forming a protection layer to protect the protection region, and exposing the non-protection region; turning to HK FOUP, etching to remove the oxide layer in the non-protection region, and exposing the TiN in the non-protection region; removing the protection layer of the protection area; etching to remove TiN in a non-protection region; depositing an oxide layer, and wrapping TiN of the protection area; etching to remove the oxide layer at the top of the protection region and the bottom of the groove to form an oxide layer side wall; and etching to remove the TiN at the top</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220301&amp;DB=EPODOC&amp;CC=CN&amp;NR=114121633A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220301&amp;DB=EPODOC&amp;CC=CN&amp;NR=114121633A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEN HAIDONG</creatorcontrib><creatorcontrib>GAO HAIXIA</creatorcontrib><title>Method for manufacturing floating gate TiN film of ultra-flash memory</title><description>The invention discloses a method for manufacturing a floating gate TiN film of an ultra-flash memory, which comprises the following steps of: completing a preorder process according to the prior art until groove etching is completed; transferring to HK FOUP, and depositing TiN; depositing an oxide layer, and wrapping TiN; wafer back cleaning is transferred to HL FOUP; photoetching to define a protection region and a non-protection region, forming a protection layer to protect the protection region, and exposing the non-protection region; turning to HK FOUP, etching to remove the oxide layer in the non-protection region, and exposing the TiN in the non-protection region; removing the protection layer of the protection area; etching to remove TiN in a non-protection region; depositing an oxide layer, and wrapping TiN of the protection area; etching to remove the oxide layer at the top of the protection region and the bottom of the groove to form an oxide layer side wall; and etching to remove the TiN at the top</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1TS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSMvJTywBMdITS1IVQjL9FNIyc3IV8tMUSnNKihJ103ISizMUclNz84sqeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGJoZGhmbGxozExagDOJzLN</recordid><startdate>20220301</startdate><enddate>20220301</enddate><creator>WEN HAIDONG</creator><creator>GAO HAIXIA</creator><scope>EVB</scope></search><sort><creationdate>20220301</creationdate><title>Method for manufacturing floating gate TiN film of ultra-flash memory</title><author>WEN HAIDONG ; GAO HAIXIA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114121633A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WEN HAIDONG</creatorcontrib><creatorcontrib>GAO HAIXIA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEN HAIDONG</au><au>GAO HAIXIA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing floating gate TiN film of ultra-flash memory</title><date>2022-03-01</date><risdate>2022</risdate><abstract>The invention discloses a method for manufacturing a floating gate TiN film of an ultra-flash memory, which comprises the following steps of: completing a preorder process according to the prior art until groove etching is completed; transferring to HK FOUP, and depositing TiN; depositing an oxide layer, and wrapping TiN; wafer back cleaning is transferred to HL FOUP; photoetching to define a protection region and a non-protection region, forming a protection layer to protect the protection region, and exposing the non-protection region; turning to HK FOUP, etching to remove the oxide layer in the non-protection region, and exposing the TiN in the non-protection region; removing the protection layer of the protection area; etching to remove TiN in a non-protection region; depositing an oxide layer, and wrapping TiN of the protection area; etching to remove the oxide layer at the top of the protection region and the bottom of the groove to form an oxide layer side wall; and etching to remove the TiN at the top</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for manufacturing floating gate TiN film of ultra-flash memory
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T20%3A10%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WEN%20HAIDONG&rft.date=2022-03-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114121633A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true