Image acquisition method, image acquisition apparatus, and wafer inspection apparatus

The invention discloses an image acquisition method, an image acquisition apparatus and a wafer inspection apparatus. A line scan camera is disposed above a wafer transfer path to continuously acquire local images having a predetermined size by imaging a scan region including a portion of the transf...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WOO MYUNG-HUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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