Byproduct collecting device of semiconductor equipment and semiconductor equipment

The invention provides a by-product collecting device of semiconductor equipment and the semiconductor equipment, the by-product collecting device of the semiconductor equipment comprises a condensation part, a connecting pipeline, a collecting part and a dredging assembly, the condensation part is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAN SHIQUAN, CHEN JIANSHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YAN SHIQUAN
CHEN JIANSHENG
description The invention provides a by-product collecting device of semiconductor equipment and the semiconductor equipment, the by-product collecting device of the semiconductor equipment comprises a condensation part, a connecting pipeline, a collecting part and a dredging assembly, the condensation part is communicated with an exhaust device of the semiconductor equipment and is used for cooling gaseous by-products discharged by the exhaust device, and the connecting pipeline is communicated with the collecting part; the connecting pipeline communicates with the condensing component and the collecting component, the dredging assembly is used for scraping the liquid by-products attached to the interior of the connecting pipeline so as to dredge the connecting pipeline, and the connecting pipeline is used for guiding the liquid by-products from the condensing component to the collecting component. And the collecting part is used for collecting liquid by-products. According to the by-product collecting device of the sem
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114100183A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114100183A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114100183A3</originalsourceid><addsrcrecordid>eNrjZAhyqiwoyk8pTS5RSM7PyUlNLsnMS1dISS3LTE5VyE9TKE7NzUzOzwMpyC9SSC0szSzITc0rUUjMS8Elx8PAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA1NDA0MDC2MHY2JUQMApk45JQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Byproduct collecting device of semiconductor equipment and semiconductor equipment</title><source>esp@cenet</source><creator>YAN SHIQUAN ; CHEN JIANSHENG</creator><creatorcontrib>YAN SHIQUAN ; CHEN JIANSHENG</creatorcontrib><description>The invention provides a by-product collecting device of semiconductor equipment and the semiconductor equipment, the by-product collecting device of the semiconductor equipment comprises a condensation part, a connecting pipeline, a collecting part and a dredging assembly, the condensation part is communicated with an exhaust device of the semiconductor equipment and is used for cooling gaseous by-products discharged by the exhaust device, and the connecting pipeline is communicated with the collecting part; the connecting pipeline communicates with the condensing component and the collecting component, the dredging assembly is used for scraping the liquid by-products attached to the interior of the connecting pipeline so as to dredge the connecting pipeline, and the connecting pipeline is used for guiding the liquid by-products from the condensing component to the collecting component. And the collecting part is used for collecting liquid by-products. According to the by-product collecting device of the sem</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SEMICONDUCTOR DEVICES ; SEPARATION ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220301&amp;DB=EPODOC&amp;CC=CN&amp;NR=114100183A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220301&amp;DB=EPODOC&amp;CC=CN&amp;NR=114100183A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAN SHIQUAN</creatorcontrib><creatorcontrib>CHEN JIANSHENG</creatorcontrib><title>Byproduct collecting device of semiconductor equipment and semiconductor equipment</title><description>The invention provides a by-product collecting device of semiconductor equipment and the semiconductor equipment, the by-product collecting device of the semiconductor equipment comprises a condensation part, a connecting pipeline, a collecting part and a dredging assembly, the condensation part is communicated with an exhaust device of the semiconductor equipment and is used for cooling gaseous by-products discharged by the exhaust device, and the connecting pipeline is communicated with the collecting part; the connecting pipeline communicates with the condensing component and the collecting component, the dredging assembly is used for scraping the liquid by-products attached to the interior of the connecting pipeline so as to dredge the connecting pipeline, and the connecting pipeline is used for guiding the liquid by-products from the condensing component to the collecting component. And the collecting part is used for collecting liquid by-products. According to the by-product collecting device of the sem</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SEPARATION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhyqiwoyk8pTS5RSM7PyUlNLsnMS1dISS3LTE5VyE9TKE7NzUzOzwMpyC9SSC0szSzITc0rUUjMS8Elx8PAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA1NDA0MDC2MHY2JUQMApk45JQ</recordid><startdate>20220301</startdate><enddate>20220301</enddate><creator>YAN SHIQUAN</creator><creator>CHEN JIANSHENG</creator><scope>EVB</scope></search><sort><creationdate>20220301</creationdate><title>Byproduct collecting device of semiconductor equipment and semiconductor equipment</title><author>YAN SHIQUAN ; CHEN JIANSHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114100183A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SEPARATION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAN SHIQUAN</creatorcontrib><creatorcontrib>CHEN JIANSHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAN SHIQUAN</au><au>CHEN JIANSHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Byproduct collecting device of semiconductor equipment and semiconductor equipment</title><date>2022-03-01</date><risdate>2022</risdate><abstract>The invention provides a by-product collecting device of semiconductor equipment and the semiconductor equipment, the by-product collecting device of the semiconductor equipment comprises a condensation part, a connecting pipeline, a collecting part and a dredging assembly, the condensation part is communicated with an exhaust device of the semiconductor equipment and is used for cooling gaseous by-products discharged by the exhaust device, and the connecting pipeline is communicated with the collecting part; the connecting pipeline communicates with the condensing component and the collecting component, the dredging assembly is used for scraping the liquid by-products attached to the interior of the connecting pipeline so as to dredge the connecting pipeline, and the connecting pipeline is used for guiding the liquid by-products from the condensing component to the collecting component. And the collecting part is used for collecting liquid by-products. According to the by-product collecting device of the sem</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN114100183A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
SEPARATION
TRANSPORTING
title Byproduct collecting device of semiconductor equipment and semiconductor equipment
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T03%3A12%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAN%20SHIQUAN&rft.date=2022-03-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114100183A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true