NON-AQUEQUS SOLDER FLUX COMPOSITION

Non-aqueous solder flux compositions are disclosed. In some aspects, the compositions comprise: (a) an alkylbenzene sulfonic acid or an acidic phosphate ester; and (b) an alkanolamide, an ethoxylated alkanolamide, an alkanolamine, or an ethoxylated amine. Methods of making solder flux compositions and methods of using the compositions as components of tacky solder fluxes are described. The solder flux compositions have excellent wettability, oxide removal capability, and rheological characteristics for high-speed, pick-and-place manufacturing processes and can be made from a simple combination of two components, thereby avoiding the need for solvents, polymeric thickeners, and other components of traditional tacky solder fluxes. 公开了非水性焊剂组合物。在某些方面，该组合物包括：(a)烷基苯磺酸或酸性磷酸酯；和(b)烷醇酰胺、乙氧基化烷醇酰胺、烷醇胺或乙氧基化胺。描述了制备焊剂组合物的方法和使用该组合物作为粘性焊剂成分的方法。该焊剂组合物具有优良的润湿性、氧化物去除能力和流变特性，适用于高速、取放式制造过程，并可由两种成分的简单组合制成，从而避免了对溶剂、聚合增稠剂和传统粘性焊剂的其他成分的需求。