Manufacturing method of high-frequency mixed pressed board
The invention discloses a manufacturing method of a high-frequency mixed pressed board. The manufacturing method comprises the following steps of: 1, cleaning and drying a substrate, cutting the substrate into a proper shape, plating copper, and performing etching to form a circuit pattern, so as to...
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| creator | LUO XINCHENG LUO MAN LIU CHENGYUN |
| description | The invention discloses a manufacturing method of a high-frequency mixed pressed board. The manufacturing method comprises the following steps of: 1, cleaning and drying a substrate, cutting the substrate into a proper shape, plating copper, and performing etching to form a circuit pattern, so as to obtain a circuit board; 2, preparing an upper circuit board and a lower circuit board, and then preparing two prepregs and a high-frequency material layer for later use; 3, laying the lower circuit board on a flat table top, and then laying the first prepreg, the high-frequency material layer, the second prepreg and the upper circuit board on the surface of the lower circuit in sequence to obtain a to-be-pressed board; and 4, performing hot pressing treatment on the to-be-pressed board through a hydraulic machine, so as to obtain the high-frequency mixed pressed board. The whole manufacturing method is simple and easy to operate. Compared with a traditional manufacturing method, the high-frequency material layer u |
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The manufacturing method comprises the following steps of: 1, cleaning and drying a substrate, cutting the substrate into a proper shape, plating copper, and performing etching to form a circuit pattern, so as to obtain a circuit board; 2, preparing an upper circuit board and a lower circuit board, and then preparing two prepregs and a high-frequency material layer for later use; 3, laying the lower circuit board on a flat table top, and then laying the first prepreg, the high-frequency material layer, the second prepreg and the upper circuit board on the surface of the lower circuit in sequence to obtain a to-be-pressed board; and 4, performing hot pressing treatment on the to-be-pressed board through a hydraulic machine, so as to obtain the high-frequency mixed pressed board. The whole manufacturing method is simple and easy to operate. 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The manufacturing method comprises the following steps of: 1, cleaning and drying a substrate, cutting the substrate into a proper shape, plating copper, and performing etching to form a circuit pattern, so as to obtain a circuit board; 2, preparing an upper circuit board and a lower circuit board, and then preparing two prepregs and a high-frequency material layer for later use; 3, laying the lower circuit board on a flat table top, and then laying the first prepreg, the high-frequency material layer, the second prepreg and the upper circuit board on the surface of the lower circuit in sequence to obtain a to-be-pressed board; and 4, performing hot pressing treatment on the to-be-pressed board through a hydraulic machine, so as to obtain the high-frequency mixed pressed board. The whole manufacturing method is simple and easy to operate. 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The manufacturing method comprises the following steps of: 1, cleaning and drying a substrate, cutting the substrate into a proper shape, plating copper, and performing etching to form a circuit pattern, so as to obtain a circuit board; 2, preparing an upper circuit board and a lower circuit board, and then preparing two prepregs and a high-frequency material layer for later use; 3, laying the lower circuit board on a flat table top, and then laying the first prepreg, the high-frequency material layer, the second prepreg and the upper circuit board on the surface of the lower circuit in sequence to obtain a to-be-pressed board; and 4, performing hot pressing treatment on the to-be-pressed board through a hydraulic machine, so as to obtain the high-frequency mixed pressed board. The whole manufacturing method is simple and easy to operate. Compared with a traditional manufacturing method, the high-frequency material layer u</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Manufacturing method of high-frequency mixed pressed board |
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