Comprehensive management device for solution in electroplating bath
The invention belongs to purification equipment, and particularly relates to a comprehensive management device for a solution in an electroplating bath. The comprehensive management device comprises a supporting platform, wherein a circulating tank and a filter are arranged on the supporting platfor...
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| creator | WEI JINYU YAO GUANGYI YAN LIN YU TIEZHU |
| description | The invention belongs to purification equipment, and particularly relates to a comprehensive management device for a solution in an electroplating bath. The comprehensive management device comprises a supporting platform, wherein a circulating tank and a filter are arranged on the supporting platform, BaCO3 is placed in the circulating tank, a solution inlet pipe is arranged between the bottom of the circulating tank and the filter, a circulating pump is arranged in the solution inlet pipe, a solution return pipe is arranged at the bottom of the filter and simultaneously communicates with a solution outlet pipe and a clear liquid pipe, one end, far away from the solution return pipe, of the solution outlet pipe communicates with the top of the circulating tank, one end, far away from the solution return pipe, of the clear liquid pipe extends towards the outer side of the supporting platform, valves are arranged on the solution outlet pipe and the clear liquid pipe, a pure water pipe communicates with the filt |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114016119A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114016119A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114016119A3</originalsourceid><addsrcrecordid>eNqNyjEKAjEQBdBtLES9w3gAwaAIlhIUKyv7ZYx_dwPJTEjGPb-NB7B6zVt23msuFROkxRmUWXhEhhi9MccAGrRS0_SxqEJRCAnBqpbEFmWkF9u07hYDp4bNz1W3vV2f_r5D0R6tcIDAev9w7rh3J-fOl8M_5wvGfjL2</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Comprehensive management device for solution in electroplating bath</title><source>esp@cenet</source><creator>WEI JINYU ; YAO GUANGYI ; YAN LIN ; YU TIEZHU</creator><creatorcontrib>WEI JINYU ; YAO GUANGYI ; YAN LIN ; YU TIEZHU</creatorcontrib><description>The invention belongs to purification equipment, and particularly relates to a comprehensive management device for a solution in an electroplating bath. The comprehensive management device comprises a supporting platform, wherein a circulating tank and a filter are arranged on the supporting platform, BaCO3 is placed in the circulating tank, a solution inlet pipe is arranged between the bottom of the circulating tank and the filter, a circulating pump is arranged in the solution inlet pipe, a solution return pipe is arranged at the bottom of the filter and simultaneously communicates with a solution outlet pipe and a clear liquid pipe, one end, far away from the solution return pipe, of the solution outlet pipe communicates with the top of the circulating tank, one end, far away from the solution return pipe, of the clear liquid pipe extends towards the outer side of the supporting platform, valves are arranged on the solution outlet pipe and the clear liquid pipe, a pure water pipe communicates with the filt</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220208&DB=EPODOC&CC=CN&NR=114016119A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220208&DB=EPODOC&CC=CN&NR=114016119A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEI JINYU</creatorcontrib><creatorcontrib>YAO GUANGYI</creatorcontrib><creatorcontrib>YAN LIN</creatorcontrib><creatorcontrib>YU TIEZHU</creatorcontrib><title>Comprehensive management device for solution in electroplating bath</title><description>The invention belongs to purification equipment, and particularly relates to a comprehensive management device for a solution in an electroplating bath. The comprehensive management device comprises a supporting platform, wherein a circulating tank and a filter are arranged on the supporting platform, BaCO3 is placed in the circulating tank, a solution inlet pipe is arranged between the bottom of the circulating tank and the filter, a circulating pump is arranged in the solution inlet pipe, a solution return pipe is arranged at the bottom of the filter and simultaneously communicates with a solution outlet pipe and a clear liquid pipe, one end, far away from the solution return pipe, of the solution outlet pipe communicates with the top of the circulating tank, one end, far away from the solution return pipe, of the clear liquid pipe extends towards the outer side of the supporting platform, valves are arranged on the solution outlet pipe and the clear liquid pipe, a pure water pipe communicates with the filt</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKAjEQBdBtLES9w3gAwaAIlhIUKyv7ZYx_dwPJTEjGPb-NB7B6zVt23msuFROkxRmUWXhEhhi9MccAGrRS0_SxqEJRCAnBqpbEFmWkF9u07hYDp4bNz1W3vV2f_r5D0R6tcIDAev9w7rh3J-fOl8M_5wvGfjL2</recordid><startdate>20220208</startdate><enddate>20220208</enddate><creator>WEI JINYU</creator><creator>YAO GUANGYI</creator><creator>YAN LIN</creator><creator>YU TIEZHU</creator><scope>EVB</scope></search><sort><creationdate>20220208</creationdate><title>Comprehensive management device for solution in electroplating bath</title><author>WEI JINYU ; YAO GUANGYI ; YAN LIN ; YU TIEZHU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114016119A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>WEI JINYU</creatorcontrib><creatorcontrib>YAO GUANGYI</creatorcontrib><creatorcontrib>YAN LIN</creatorcontrib><creatorcontrib>YU TIEZHU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEI JINYU</au><au>YAO GUANGYI</au><au>YAN LIN</au><au>YU TIEZHU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Comprehensive management device for solution in electroplating bath</title><date>2022-02-08</date><risdate>2022</risdate><abstract>The invention belongs to purification equipment, and particularly relates to a comprehensive management device for a solution in an electroplating bath. The comprehensive management device comprises a supporting platform, wherein a circulating tank and a filter are arranged on the supporting platform, BaCO3 is placed in the circulating tank, a solution inlet pipe is arranged between the bottom of the circulating tank and the filter, a circulating pump is arranged in the solution inlet pipe, a solution return pipe is arranged at the bottom of the filter and simultaneously communicates with a solution outlet pipe and a clear liquid pipe, one end, far away from the solution return pipe, of the solution outlet pipe communicates with the top of the circulating tank, one end, far away from the solution return pipe, of the clear liquid pipe extends towards the outer side of the supporting platform, valves are arranged on the solution outlet pipe and the clear liquid pipe, a pure water pipe communicates with the filt</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Comprehensive management device for solution in electroplating bath |
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