Heat dissipation film and electronic equipment
The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a batt...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | QI XINGLIANG XIAO YAO |
description | The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a battery protection film arranged on the edge of the battery body; the heat dissipation film comprises a first protection layer, a first bonding layer, a graphite heat dissipation layer and a second protection layer which are sequentially laminated; the heat dissipation film comprises a first connecting area and a second connecting area, the first connecting area corresponds to the loudspeaker in position, and the second connecting area corresponds to part of the battery in position; the first protective layer is arranged in the second connecting area so as to shield the area, located in the second connecting area, of the first bonding layer; and a second bonding layer is arranged on one side, far away from the first bo |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113999621A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113999621A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113999621A3</originalsourceid><addsrcrecordid>eNrjZNDzSE0sUUjJLC7OLEgsyczPU0jLzMlVSMxLUUjNSU0uKcrPy0xWSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hobGlpaWZkaGjsbEqAEAChAqyw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat dissipation film and electronic equipment</title><source>esp@cenet</source><creator>QI XINGLIANG ; XIAO YAO</creator><creatorcontrib>QI XINGLIANG ; XIAO YAO</creatorcontrib><description>The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a battery protection film arranged on the edge of the battery body; the heat dissipation film comprises a first protection layer, a first bonding layer, a graphite heat dissipation layer and a second protection layer which are sequentially laminated; the heat dissipation film comprises a first connecting area and a second connecting area, the first connecting area corresponds to the loudspeaker in position, and the second connecting area corresponds to part of the battery in position; the first protective layer is arranged in the second connecting area so as to shield the area, located in the second connecting area, of the first bonding layer; and a second bonding layer is arranged on one side, far away from the first bo</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220201&DB=EPODOC&CC=CN&NR=113999621A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220201&DB=EPODOC&CC=CN&NR=113999621A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QI XINGLIANG</creatorcontrib><creatorcontrib>XIAO YAO</creatorcontrib><title>Heat dissipation film and electronic equipment</title><description>The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a battery protection film arranged on the edge of the battery body; the heat dissipation film comprises a first protection layer, a first bonding layer, a graphite heat dissipation layer and a second protection layer which are sequentially laminated; the heat dissipation film comprises a first connecting area and a second connecting area, the first connecting area corresponds to the loudspeaker in position, and the second connecting area corresponds to part of the battery in position; the first protective layer is arranged in the second connecting area so as to shield the area, located in the second connecting area, of the first bonding layer; and a second bonding layer is arranged on one side, far away from the first bo</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDzSE0sUUjJLC7OLEgsyczPU0jLzMlVSMxLUUjNSU0uKcrPy0xWSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hobGlpaWZkaGjsbEqAEAChAqyw</recordid><startdate>20220201</startdate><enddate>20220201</enddate><creator>QI XINGLIANG</creator><creator>XIAO YAO</creator><scope>EVB</scope></search><sort><creationdate>20220201</creationdate><title>Heat dissipation film and electronic equipment</title><author>QI XINGLIANG ; XIAO YAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113999621A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>QI XINGLIANG</creatorcontrib><creatorcontrib>XIAO YAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QI XINGLIANG</au><au>XIAO YAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat dissipation film and electronic equipment</title><date>2022-02-01</date><risdate>2022</risdate><abstract>The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a battery protection film arranged on the edge of the battery body; the heat dissipation film comprises a first protection layer, a first bonding layer, a graphite heat dissipation layer and a second protection layer which are sequentially laminated; the heat dissipation film comprises a first connecting area and a second connecting area, the first connecting area corresponds to the loudspeaker in position, and the second connecting area corresponds to part of the battery in position; the first protective layer is arranged in the second connecting area so as to shield the area, located in the second connecting area, of the first bonding layer; and a second bonding layer is arranged on one side, far away from the first bo</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN113999621A |
source | esp@cenet |
subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
title | Heat dissipation film and electronic equipment |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T05%3A42%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=QI%20XINGLIANG&rft.date=2022-02-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113999621A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |