Heat dissipation film and electronic equipment

The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a batt...

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Hauptverfasser: QI XINGLIANG, XIAO YAO
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creator QI XINGLIANG
XIAO YAO
description The embodiment of the invention provides a heat dissipation film and electronic equipment. The heat dissipation film is used for the electronic equipment, the electronic equipment comprises a battery and a loudspeaker which are arranged adjacently, and the battery comprises a battery body and a battery protection film arranged on the edge of the battery body; the heat dissipation film comprises a first protection layer, a first bonding layer, a graphite heat dissipation layer and a second protection layer which are sequentially laminated; the heat dissipation film comprises a first connecting area and a second connecting area, the first connecting area corresponds to the loudspeaker in position, and the second connecting area corresponds to part of the battery in position; the first protective layer is arranged in the second connecting area so as to shield the area, located in the second connecting area, of the first bonding layer; and a second bonding layer is arranged on one side, far away from the first bo
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language chi ; eng
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
title Heat dissipation film and electronic equipment
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