Chip packaging device

Chip packaging device

The invention discloses a chip packaging device. A frame body assembly comprises a shell, an indicating lamp arranged on the shell and a packaging plate arranged at the top of the shell; and the packaging assembly comprises a sliding block arranged at the bottom of the packaging plate, a guide plate...

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Hauptverfasser: LIAO QILIN, YAN HONGYUAN, GONG DAJIANG, FANG WANCONG, GU JIANBING, CHEN BENFU, CHANG QIANG, LIU XIULI, XU CHAO, GUAN YANLIN, WANG YONG, RAN XIAOQIANG
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIAO QILIN
YAN HONGYUAN
GONG DAJIANG
FANG WANCONG
GU JIANBING
CHEN BENFU
CHANG QIANG
LIU XIULI
XU CHAO
GUAN YANLIN
WANG YONG
RAN XIAOQIANG
description The invention discloses a chip packaging device. A frame body assembly comprises a shell, an indicating lamp arranged on the shell and a packaging plate arranged at the top of the shell; and the packaging assembly comprises a sliding block arranged at the bottom of the packaging plate, a guide plate arranged on the sliding block and a clamping piece arranged at the bottom of the shell, a rotating wheel is arranged below the sliding block, the rotating wheel is rotationally connected with the inner wall of the shell, four clamping teeth are arranged on the rotating wheel, a flexible belt matched with the clamping teeth is arranged on one side of the clamping teeth, the clamping piece comprises a pressing plate arranged at the bottom of the shell, a movable rod movably connected with the pressing plate and a clamping block movably connected to one end of the movable rod, and the pressing plate is movably connected with the bottom of the flexible belt.The connection to the chip communication interface automatica
format Patent
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip packaging device
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