Circuit shape-preserving etching manufacturing method based on semi-additive process
The invention belongs to the technical field of printed circuit boards, and discloses a circuit shape-preserving etching manufacturing method based on a semi-additive process. The method comprises the following steps: 1, chemically plating copper on a substrate to form a thin copper seed layer; 2, p...
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| creator | LU PEIPEI HAO ZHIFENG PAN ZHANCHANG ZHENG PEIFENG CUI ZIYA HU GUANGHUI |
| description | The invention belongs to the technical field of printed circuit boards, and discloses a circuit shape-preserving etching manufacturing method based on a semi-additive process. The method comprises the following steps: 1, chemically plating copper on a substrate to form a thin copper seed layer; 2, pasting a dry film on the copper seed layer, exposing and developing, and plating an anti-corrosion metal layer on a copper-exposed part; 3, after the dry film is removed, placing the film in an etching solution for etching; and 4, performing electro-coppering on the etched sample, and repairing the corroded side wall while thickening a copper circuit. According to the method, the rectangular shape of the circuit can be protected, meanwhile, side wall concave etching caused by rapid etching can be repaired, and the method has practical value in the aspect of manufacturing of high-end circuit boards like carrier plates.
本发明属于印刷电路板技术领域，公开了一种基于半加成法的线路保型蚀刻的制作方法。该方法包括以下步骤：1.在基材上化学镀铜，形成薄层铜种子层；2.铜种子层上贴干膜，曝光显影后，于露铜部分镀上防腐金属层 |
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本发明属于印刷电路板技术领域，公开了一种基于半加成法的线路保型蚀刻的制作方法。该方法包括以下步骤：1.在基材上化学镀铜，形成薄层铜种子层；2.铜种子层上贴干膜，曝光显影后，于露铜部分镀上防腐金属层</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220104&DB=EPODOC&CC=CN&NR=113891569A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220104&DB=EPODOC&CC=CN&NR=113891569A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU PEIPEI</creatorcontrib><creatorcontrib>HAO ZHIFENG</creatorcontrib><creatorcontrib>PAN ZHANCHANG</creatorcontrib><creatorcontrib>ZHENG PEIFENG</creatorcontrib><creatorcontrib>CUI ZIYA</creatorcontrib><creatorcontrib>HU GUANGHUI</creatorcontrib><title>Circuit shape-preserving etching manufacturing method based on semi-additive process</title><description>The invention belongs to the technical field of printed circuit boards, and discloses a circuit shape-preserving etching manufacturing method based on a semi-additive process. The method comprises the following steps: 1, chemically plating copper on a substrate to form a thin copper seed layer; 2, pasting a dry film on the copper seed layer, exposing and developing, and plating an anti-corrosion metal layer on a copper-exposed part; 3, after the dry film is removed, placing the film in an etching solution for etching; and 4, performing electro-coppering on the etched sample, and repairing the corroded side wall while thickening a copper circuit. According to the method, the rectangular shape of the circuit can be protected, meanwhile, side wall concave etching caused by rapid etching can be repaired, and the method has practical value in the aspect of manufacturing of high-end circuit boards like carrier plates.
本发明属于印刷电路板技术领域，公开了一种基于半加成法的线路保型蚀刻的制作方法。该方法包括以下步骤：1.在基材上化学镀铜，形成薄层铜种子层；2.铜种子层上贴干膜，曝光显影后，于露铜部分镀上防腐金属层</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAURuEsDqK-Q3yADKEodpSgODl1L9fkrwnYJOQmfX5RfACnjwNnLQYTim2hSvaUoXIBoywhPiWq9R9nim0iW1v5FqpPTj6I4WSKkjEHRc6FGhbIXJIF81asJnoxdj83Yn-9DOamkNMIzmQRUUdz17o79fpw7M_dP88b72M5fg</recordid><startdate>20220104</startdate><enddate>20220104</enddate><creator>LU PEIPEI</creator><creator>HAO ZHIFENG</creator><creator>PAN ZHANCHANG</creator><creator>ZHENG PEIFENG</creator><creator>CUI ZIYA</creator><creator>HU GUANGHUI</creator><scope>EVB</scope></search><sort><creationdate>20220104</creationdate><title>Circuit shape-preserving etching manufacturing method based on semi-additive process</title><author>LU PEIPEI ; HAO ZHIFENG ; PAN ZHANCHANG ; ZHENG PEIFENG ; CUI ZIYA ; HU GUANGHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113891569A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LU PEIPEI</creatorcontrib><creatorcontrib>HAO ZHIFENG</creatorcontrib><creatorcontrib>PAN ZHANCHANG</creatorcontrib><creatorcontrib>ZHENG PEIFENG</creatorcontrib><creatorcontrib>CUI ZIYA</creatorcontrib><creatorcontrib>HU GUANGHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU PEIPEI</au><au>HAO ZHIFENG</au><au>PAN ZHANCHANG</au><au>ZHENG PEIFENG</au><au>CUI ZIYA</au><au>HU GUANGHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit shape-preserving etching manufacturing method based on semi-additive process</title><date>2022-01-04</date><risdate>2022</risdate><abstract>The invention belongs to the technical field of printed circuit boards, and discloses a circuit shape-preserving etching manufacturing method based on a semi-additive process. The method comprises the following steps: 1, chemically plating copper on a substrate to form a thin copper seed layer; 2, pasting a dry film on the copper seed layer, exposing and developing, and plating an anti-corrosion metal layer on a copper-exposed part; 3, after the dry film is removed, placing the film in an etching solution for etching; and 4, performing electro-coppering on the etched sample, and repairing the corroded side wall while thickening a copper circuit. According to the method, the rectangular shape of the circuit can be protected, meanwhile, side wall concave etching caused by rapid etching can be repaired, and the method has practical value in the aspect of manufacturing of high-end circuit boards like carrier plates.
本发明属于印刷电路板技术领域，公开了一种基于半加成法的线路保型蚀刻的制作方法。该方法包括以下步骤：1.在基材上化学镀铜，形成薄层铜种子层；2.铜种子层上贴干膜，曝光显影后，于露铜部分镀上防腐金属层</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Circuit shape-preserving etching manufacturing method based on semi-additive process |
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