PROCESSING SYSTEM AND PROCESSING METHOD
This processing system is provided with a housing (6) which internally accommodates an object (W) and which has formed therein a part (62) through which light can pass, a radiating device (211) which radiates a processing beam (PL) for processing the object, a first member (651) onto which an energy...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This processing system is provided with a housing (6) which internally accommodates an object (W) and which has formed therein a part (62) through which light can pass, a radiating device (211) which radiates a processing beam (PL) for processing the object, a first member (651) onto which an energy beam (EL) from the radiating device, directed toward the outside of the housing through said part, is incident, and a second member (652) onto which the energy beam that has passed through the first member is incident, wherein the first member reduces the intensity of the energy beam incident on the first member, and the second member reduces the intensity of the energy beam from the first member, incident on the second member.
加工系统具有:壳体(6),其在内部收纳物体(W),该壳体(6)形成有能够供光通过的部分(62);照射装置(211),其照射对物体进行加工的加工光束(PL);第1部件(651),经由所述部分而朝向壳体的外部的来自照射装置的能量光束(EL)入射到该第1部件(651);以及第2部件(652),通过了第1部件的能量光束入射到该第2部件(652),第1部件降低入射到第1部件的能量光束的强度,第2部件降低从第1部件入射到第2部件的能量光束的强度。 |
---|