Structure and method for improving tin ion penetration pin of frame type product

The invention provides an improvement structure and method for tin ion penetration of a frame product into a pin. A front half-etched area is arranged at the pin, and when tin ions flow along the pin, the front half-etched area effectively breaks the flow of the tin ions at the pin, so the tin ions...

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Hauptverfasser: GUO XIAOWEI, MA MIANZHI, HOU XIANYAO, CUI XUELI, LI WANXIA, LYU HAILAN
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creator GUO XIAOWEI
MA MIANZHI
HOU XIANYAO
CUI XUELI
LI WANXIA
LYU HAILAN
description The invention provides an improvement structure and method for tin ion penetration of a frame product into a pin. A front half-etched area is arranged at the pin, and when tin ions flow along the pin, the front half-etched area effectively breaks the flow of the tin ions at the pin, so the tin ions are prevented from seeping into the pin, the tin ions are prevented from corroding and fusing a welding wire, and the performance of the product is effectively ensured. 本发明提供了一种框架类产品锡离子渗入管脚的改善结构及方法,在管脚处设置了正面半蚀刻区域,当锡离子沿着管脚流动时,正面半蚀刻区域有效的分断了锡离子在管脚处的流动,从而阻止锡离子渗进管脚,避免锡离子腐蚀熔断焊线,有效的保证了产品的性能。
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Structure and method for improving tin ion penetration pin of frame type product
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