Circuit board assembly and spaceborne computer

Circuit board assembly and spaceborne computer

The invention provides a circuit board assembly and a spaceborne computer. The circuit board assembly comprises a shell, a PCB and heat conduction insulating oil; the shell defines a closed accommodating cavity, the PCB is arranged in the closed accommodating cavity, and an electronic device is arra...

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Hauptverfasser: SHEN JINGSHI, LIU ZHIGUO, LIU SHUMENG, CHEN ANBANG, FENG MINGKUAN, JIAO YUNLIANG, ZHOU JIANWEI, LI YISHI, YANG KAIWEN, WU HUI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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creator SHEN JINGSHI
LIU ZHIGUO
LIU SHUMENG
CHEN ANBANG
FENG MINGKUAN
JIAO YUNLIANG
ZHOU JIANWEI
LI YISHI
YANG KAIWEN
WU HUI
description The invention provides a circuit board assembly and a spaceborne computer. The circuit board assembly comprises a shell, a PCB and heat conduction insulating oil; the shell defines a closed accommodating cavity, the PCB is arranged in the closed accommodating cavity, and an electronic device is arranged on the PCB. And a gap between the shell and the PCB is filled with heat-conducting insulating oil, so that heat generated by the electronic device is conducted to the shell through the heat-conducting insulating oil. According to the circuit board assembly, the PCB is arranged in the containing cavity defined by the shell, the heat-conducting insulating oil is adopted as a heat-conducting medium, after the containing cavity is filled with the heat-conducting insulating oil, the insulating oil can completely wrap the surfaces of the components, the heat dissipation area is increased to the maximum degree, and the effect that all parts on the PCB are uniform in temperature is facilitated; meanwhile, higher heat
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113760068A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113760068A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113760068A3</originalsourceid><addsrcrecordid>eNrjZNBzzixKLs0sUUjKTyxKUUgsLk7NTcqpVEjMS1EoLkhMTk3KL8pLVUjOzy0oLUkt4mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqWANeakl8c5-hobG5mYGBmYWjsbEqAEABusqtA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board assembly and spaceborne computer</title><source>esp@cenet</source><creator>SHEN JINGSHI ; LIU ZHIGUO ; LIU SHUMENG ; CHEN ANBANG ; FENG MINGKUAN ; JIAO YUNLIANG ; ZHOU JIANWEI ; LI YISHI ; YANG KAIWEN ; WU HUI</creator><creatorcontrib>SHEN JINGSHI ; LIU ZHIGUO ; LIU SHUMENG ; CHEN ANBANG ; FENG MINGKUAN ; JIAO YUNLIANG ; ZHOU JIANWEI ; LI YISHI ; YANG KAIWEN ; WU HUI</creatorcontrib><description>The invention provides a circuit board assembly and a spaceborne computer. The circuit board assembly comprises a shell, a PCB and heat conduction insulating oil; the shell defines a closed accommodating cavity, the PCB is arranged in the closed accommodating cavity, and an electronic device is arranged on the PCB. And a gap between the shell and the PCB is filled with heat-conducting insulating oil, so that heat generated by the electronic device is conducted to the shell through the heat-conducting insulating oil. According to the circuit board assembly, the PCB is arranged in the containing cavity defined by the shell, the heat-conducting insulating oil is adopted as a heat-conducting medium, after the containing cavity is filled with the heat-conducting insulating oil, the insulating oil can completely wrap the surfaces of the components, the heat dissipation area is increased to the maximum degree, and the effect that all parts on the PCB are uniform in temperature is facilitated; meanwhile, higher heat</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211207&amp;DB=EPODOC&amp;CC=CN&amp;NR=113760068A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211207&amp;DB=EPODOC&amp;CC=CN&amp;NR=113760068A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHEN JINGSHI</creatorcontrib><creatorcontrib>LIU ZHIGUO</creatorcontrib><creatorcontrib>LIU SHUMENG</creatorcontrib><creatorcontrib>CHEN ANBANG</creatorcontrib><creatorcontrib>FENG MINGKUAN</creatorcontrib><creatorcontrib>JIAO YUNLIANG</creatorcontrib><creatorcontrib>ZHOU JIANWEI</creatorcontrib><creatorcontrib>LI YISHI</creatorcontrib><creatorcontrib>YANG KAIWEN</creatorcontrib><creatorcontrib>WU HUI</creatorcontrib><title>Circuit board assembly and spaceborne computer</title><description>The invention provides a circuit board assembly and a spaceborne computer. The circuit board assembly comprises a shell, a PCB and heat conduction insulating oil; the shell defines a closed accommodating cavity, the PCB is arranged in the closed accommodating cavity, and an electronic device is arranged on the PCB. And a gap between the shell and the PCB is filled with heat-conducting insulating oil, so that heat generated by the electronic device is conducted to the shell through the heat-conducting insulating oil. According to the circuit board assembly, the PCB is arranged in the containing cavity defined by the shell, the heat-conducting insulating oil is adopted as a heat-conducting medium, after the containing cavity is filled with the heat-conducting insulating oil, the insulating oil can completely wrap the surfaces of the components, the heat dissipation area is increased to the maximum degree, and the effect that all parts on the PCB are uniform in temperature is facilitated; meanwhile, higher heat</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzzixKLs0sUUjKTyxKUUgsLk7NTcqpVEjMS1EoLkhMTk3KL8pLVUjOzy0oLUkt4mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqWANeakl8c5-hobG5mYGBmYWjsbEqAEABusqtA</recordid><startdate>20211207</startdate><enddate>20211207</enddate><creator>SHEN JINGSHI</creator><creator>LIU ZHIGUO</creator><creator>LIU SHUMENG</creator><creator>CHEN ANBANG</creator><creator>FENG MINGKUAN</creator><creator>JIAO YUNLIANG</creator><creator>ZHOU JIANWEI</creator><creator>LI YISHI</creator><creator>YANG KAIWEN</creator><creator>WU HUI</creator><scope>EVB</scope></search><sort><creationdate>20211207</creationdate><title>Circuit board assembly and spaceborne computer</title><author>SHEN JINGSHI ; LIU ZHIGUO ; LIU SHUMENG ; CHEN ANBANG ; FENG MINGKUAN ; JIAO YUNLIANG ; ZHOU JIANWEI ; LI YISHI ; YANG KAIWEN ; WU HUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113760068A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHEN JINGSHI</creatorcontrib><creatorcontrib>LIU ZHIGUO</creatorcontrib><creatorcontrib>LIU SHUMENG</creatorcontrib><creatorcontrib>CHEN ANBANG</creatorcontrib><creatorcontrib>FENG MINGKUAN</creatorcontrib><creatorcontrib>JIAO YUNLIANG</creatorcontrib><creatorcontrib>ZHOU JIANWEI</creatorcontrib><creatorcontrib>LI YISHI</creatorcontrib><creatorcontrib>YANG KAIWEN</creatorcontrib><creatorcontrib>WU HUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHEN JINGSHI</au><au>LIU ZHIGUO</au><au>LIU SHUMENG</au><au>CHEN ANBANG</au><au>FENG MINGKUAN</au><au>JIAO YUNLIANG</au><au>ZHOU JIANWEI</au><au>LI YISHI</au><au>YANG KAIWEN</au><au>WU HUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board assembly and spaceborne computer</title><date>2021-12-07</date><risdate>2021</risdate><abstract>The invention provides a circuit board assembly and a spaceborne computer. The circuit board assembly comprises a shell, a PCB and heat conduction insulating oil; the shell defines a closed accommodating cavity, the PCB is arranged in the closed accommodating cavity, and an electronic device is arranged on the PCB. And a gap between the shell and the PCB is filled with heat-conducting insulating oil, so that heat generated by the electronic device is conducted to the shell through the heat-conducting insulating oil. According to the circuit board assembly, the PCB is arranged in the containing cavity defined by the shell, the heat-conducting insulating oil is adopted as a heat-conducting medium, after the containing cavity is filled with the heat-conducting insulating oil, the insulating oil can completely wrap the surfaces of the components, the heat dissipation area is increased to the maximum degree, and the effect that all parts on the PCB are uniform in temperature is facilitated; meanwhile, higher heat</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title Circuit board assembly and spaceborne computer
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