Metal evaporation source equipment
The embodiment of the invention provides metal evaporation source equipment. The metal evaporation source equipment comprises a shell, a first inner container layer, a second inner container layer and a heating wire; the first liner layer is attached to the inner wall of the shell; the second inner...
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creator | HE RANGAN LIU JINBIAO ZHOU JIE LUO NAN LIU YALOU LI YUANXING XIAO ANG LI YUANHENG QI ZEZHOU JI LEI WANG TIANHAO LIU WENHAO LIU FEI DANG BOTAN YIN MAOJI LAN DAIJIANG LI DUANRUI JIN YAJIE HU BIN |
description | The embodiment of the invention provides metal evaporation source equipment. The metal evaporation source equipment comprises a shell, a first inner container layer, a second inner container layer and a heating wire; the first liner layer is attached to the inner wall of the shell; the second inner container layer is connected with the first inner container layer or interacts with the first inner container layer and is used for fixing the heating wire; and the first inner container layer and the second inner container layer are both made of insulating materials, and the thermal stability of the insulating materials is in a stable state when the heating wire is at the preset working temperature. According to the metal evaporation source equipment, the first inner container layer made of the insulating material is added, the first inner container layer is used as an intermediate medium, then a PBN ring where tantalum is attached after tantalum volatilization is prevented from being directly connected with the s |
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The metal evaporation source equipment comprises a shell, a first inner container layer, a second inner container layer and a heating wire; the first liner layer is attached to the inner wall of the shell; the second inner container layer is connected with the first inner container layer or interacts with the first inner container layer and is used for fixing the heating wire; and the first inner container layer and the second inner container layer are both made of insulating materials, and the thermal stability of the insulating materials is in a stable state when the heating wire is at the preset working temperature. According to the metal evaporation source equipment, the first inner container layer made of the insulating material is added, the first inner container layer is used as an intermediate medium, then a PBN ring where tantalum is attached after tantalum volatilization is prevented from being directly connected with the s</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211130&DB=EPODOC&CC=CN&NR=113718204A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211130&DB=EPODOC&CC=CN&NR=113718204A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HE RANGAN</creatorcontrib><creatorcontrib>LIU JINBIAO</creatorcontrib><creatorcontrib>ZHOU JIE</creatorcontrib><creatorcontrib>LUO NAN</creatorcontrib><creatorcontrib>LIU YALOU</creatorcontrib><creatorcontrib>LI YUANXING</creatorcontrib><creatorcontrib>XIAO ANG</creatorcontrib><creatorcontrib>LI YUANHENG</creatorcontrib><creatorcontrib>QI ZEZHOU</creatorcontrib><creatorcontrib>JI LEI</creatorcontrib><creatorcontrib>WANG TIANHAO</creatorcontrib><creatorcontrib>LIU WENHAO</creatorcontrib><creatorcontrib>LIU FEI</creatorcontrib><creatorcontrib>DANG BOTAN</creatorcontrib><creatorcontrib>YIN MAOJI</creatorcontrib><creatorcontrib>LAN DAIJIANG</creatorcontrib><creatorcontrib>LI DUANRUI</creatorcontrib><creatorcontrib>JIN YAJIE</creatorcontrib><creatorcontrib>HU BIN</creatorcontrib><title>Metal evaporation source equipment</title><description>The embodiment of the invention provides metal evaporation source equipment. The metal evaporation source equipment comprises a shell, a first inner container layer, a second inner container layer and a heating wire; the first liner layer is attached to the inner wall of the shell; the second inner container layer is connected with the first inner container layer or interacts with the first inner container layer and is used for fixing the heating wire; and the first inner container layer and the second inner container layer are both made of insulating materials, and the thermal stability of the insulating materials is in a stable state when the heating wire is at the preset working temperature. According to the metal evaporation source equipment, the first inner container layer made of the insulating material is added, the first inner container layer is used as an intermediate medium, then a PBN ring where tantalum is attached after tantalum volatilization is prevented from being directly connected with the s</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDyTS1JzFFILUssyC9KLMnMz1Mozi8tSk5VSC0szSzITc0r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hobG5oYWRgYmjsbEqAEA2CMmYw</recordid><startdate>20211130</startdate><enddate>20211130</enddate><creator>HE RANGAN</creator><creator>LIU JINBIAO</creator><creator>ZHOU JIE</creator><creator>LUO NAN</creator><creator>LIU YALOU</creator><creator>LI YUANXING</creator><creator>XIAO ANG</creator><creator>LI YUANHENG</creator><creator>QI ZEZHOU</creator><creator>JI LEI</creator><creator>WANG TIANHAO</creator><creator>LIU WENHAO</creator><creator>LIU FEI</creator><creator>DANG BOTAN</creator><creator>YIN MAOJI</creator><creator>LAN DAIJIANG</creator><creator>LI DUANRUI</creator><creator>JIN YAJIE</creator><creator>HU BIN</creator><scope>EVB</scope></search><sort><creationdate>20211130</creationdate><title>Metal evaporation source equipment</title><author>HE RANGAN ; LIU JINBIAO ; ZHOU JIE ; LUO NAN ; LIU YALOU ; LI YUANXING ; XIAO ANG ; LI YUANHENG ; QI ZEZHOU ; JI LEI ; WANG TIANHAO ; LIU WENHAO ; LIU FEI ; DANG BOTAN ; YIN MAOJI ; LAN DAIJIANG ; LI DUANRUI ; JIN YAJIE ; HU BIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113718204A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>HE RANGAN</creatorcontrib><creatorcontrib>LIU JINBIAO</creatorcontrib><creatorcontrib>ZHOU JIE</creatorcontrib><creatorcontrib>LUO NAN</creatorcontrib><creatorcontrib>LIU YALOU</creatorcontrib><creatorcontrib>LI YUANXING</creatorcontrib><creatorcontrib>XIAO ANG</creatorcontrib><creatorcontrib>LI YUANHENG</creatorcontrib><creatorcontrib>QI ZEZHOU</creatorcontrib><creatorcontrib>JI LEI</creatorcontrib><creatorcontrib>WANG TIANHAO</creatorcontrib><creatorcontrib>LIU WENHAO</creatorcontrib><creatorcontrib>LIU FEI</creatorcontrib><creatorcontrib>DANG BOTAN</creatorcontrib><creatorcontrib>YIN MAOJI</creatorcontrib><creatorcontrib>LAN DAIJIANG</creatorcontrib><creatorcontrib>LI DUANRUI</creatorcontrib><creatorcontrib>JIN YAJIE</creatorcontrib><creatorcontrib>HU BIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HE RANGAN</au><au>LIU JINBIAO</au><au>ZHOU JIE</au><au>LUO NAN</au><au>LIU YALOU</au><au>LI YUANXING</au><au>XIAO ANG</au><au>LI YUANHENG</au><au>QI ZEZHOU</au><au>JI LEI</au><au>WANG TIANHAO</au><au>LIU WENHAO</au><au>LIU FEI</au><au>DANG BOTAN</au><au>YIN MAOJI</au><au>LAN DAIJIANG</au><au>LI DUANRUI</au><au>JIN YAJIE</au><au>HU BIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metal evaporation source equipment</title><date>2021-11-30</date><risdate>2021</risdate><abstract>The embodiment of the invention provides metal evaporation source equipment. The metal evaporation source equipment comprises a shell, a first inner container layer, a second inner container layer and a heating wire; the first liner layer is attached to the inner wall of the shell; the second inner container layer is connected with the first inner container layer or interacts with the first inner container layer and is used for fixing the heating wire; and the first inner container layer and the second inner container layer are both made of insulating materials, and the thermal stability of the insulating materials is in a stable state when the heating wire is at the preset working temperature. According to the metal evaporation source equipment, the first inner container layer made of the insulating material is added, the first inner container layer is used as an intermediate medium, then a PBN ring where tantalum is attached after tantalum volatilization is prevented from being directly connected with the s</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | Metal evaporation source equipment |
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