SENSOR FOR DETECTING PRESSURE AND/OR FILLING LEVEL AND/OR FLOW RATE AND/OR DENSITY AND/OR MASS AND/OR TEMPERATURE
The invention relates to a sensor (100) for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component (3) is coupled by nanowires (50) to other sensor components (2, 4, 9A, 9C, 20, 20B) and wherein the sensor components (2, 3,...
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| creator | HANESCH PAUL DI MARCO MIRKO WIEGAND ALEXANDER WILL ALEXANDER LOHMEIER FRANZ-JOSEF ROTHER ANDRE STAAB ULLRICH KRESSBACH JENS BRONNER ANDREAS CIBA JOACHIM PLEYER JURGEN |
| description | The invention relates to a sensor (100) for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component (3) is coupled by nanowires (50) to other sensor components (2, 4, 9A, 9C, 20, 20B) and wherein the sensor components (2, 3, 4, 9A, 9C, 20, 20B) are fixed together, sealed or are in electric contact. For example, one sensor component (3) is connected directly to a circuit board via nanowires (50).
本发明涉及一种用于检测压力和/或料位和/或流量和/或密度和/或质量和/或温度的传感器(100)，其中传感器构件(3)借助于纳米线(50)与另外的传感器构件(2，4，9A，9C，20，20B)耦联，并且其中传感器构件(2，3，4，9A，9C，20，20B)相对于彼此固定、密封或电接触。例如，传感器构件(3)直接与电路板经由纳米线(50)连接。 |
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本发明涉及一种用于检测压力和/或料位和/或流量和/或密度和/或质量和/或温度的传感器(100)，其中传感器构件(3)借助于纳米线(50)与另外的传感器构件(2，4，9A，9C，20，20B)耦联，并且其中传感器构件(2，3，4，9A，9C，20，20B)相对于彼此固定、密封或电接触。例如，传感器构件(3)直接与电路板经由纳米线(50)连接。</description><language>chi ; eng</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211126&DB=EPODOC&CC=CN&NR=113710999A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211126&DB=EPODOC&CC=CN&NR=113710999A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANESCH PAUL</creatorcontrib><creatorcontrib>DI MARCO MIRKO</creatorcontrib><creatorcontrib>WIEGAND ALEXANDER</creatorcontrib><creatorcontrib>WILL ALEXANDER</creatorcontrib><creatorcontrib>LOHMEIER FRANZ-JOSEF</creatorcontrib><creatorcontrib>ROTHER ANDRE</creatorcontrib><creatorcontrib>STAAB ULLRICH</creatorcontrib><creatorcontrib>KRESSBACH JENS</creatorcontrib><creatorcontrib>BRONNER ANDREAS</creatorcontrib><creatorcontrib>CIBA JOACHIM</creatorcontrib><creatorcontrib>PLEYER JURGEN</creatorcontrib><title>SENSOR FOR DETECTING PRESSURE AND/OR FILLING LEVEL AND/OR FLOW RATE AND/OR DENSITY AND/OR MASS AND/OR TEMPERATURE</title><description>The invention relates to a sensor (100) for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component (3) is coupled by nanowires (50) to other sensor components (2, 4, 9A, 9C, 20, 20B) and wherein the sensor components (2, 3, 4, 9A, 9C, 20, 20B) are fixed together, sealed or are in electric contact. For example, one sensor component (3) is connected directly to a circuit board via nanowires (50).
本发明涉及一种用于检测压力和/或料位和/或流量和/或密度和/或质量和/或温度的传感器(100)，其中传感器构件(3)借助于纳米线(50)与另外的传感器构件(2，4，9A，9C，20，20B)耦联，并且其中传感器构件(2，3，4，9A，9C，20，20B)相对于彼此固定、密封或电接触。例如，传感器构件(3)直接与电路板经由纳米线(50)连接。</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCgMdvUL9g9ScANiF9cQV-cQTz93hYAg1-Dg0CBXBUc_F32QrKePD0jcxzXM1Qcu6OMfrhDkGAJX5QI0yjMkEsb1dQwOhrFDXH0DXIFqgWbyMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ2NzQwNLS0tHY2LUAADf2zfL</recordid><startdate>20211126</startdate><enddate>20211126</enddate><creator>HANESCH PAUL</creator><creator>DI MARCO MIRKO</creator><creator>WIEGAND ALEXANDER</creator><creator>WILL ALEXANDER</creator><creator>LOHMEIER FRANZ-JOSEF</creator><creator>ROTHER ANDRE</creator><creator>STAAB ULLRICH</creator><creator>KRESSBACH JENS</creator><creator>BRONNER ANDREAS</creator><creator>CIBA JOACHIM</creator><creator>PLEYER JURGEN</creator><scope>EVB</scope></search><sort><creationdate>20211126</creationdate><title>SENSOR FOR DETECTING PRESSURE AND/OR FILLING LEVEL AND/OR FLOW RATE AND/OR DENSITY AND/OR MASS AND/OR TEMPERATURE</title><author>HANESCH PAUL ; DI MARCO MIRKO ; WIEGAND ALEXANDER ; WILL ALEXANDER ; LOHMEIER FRANZ-JOSEF ; ROTHER ANDRE ; STAAB ULLRICH ; KRESSBACH JENS ; BRONNER ANDREAS ; CIBA JOACHIM ; PLEYER JURGEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113710999A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HANESCH PAUL</creatorcontrib><creatorcontrib>DI MARCO MIRKO</creatorcontrib><creatorcontrib>WIEGAND ALEXANDER</creatorcontrib><creatorcontrib>WILL ALEXANDER</creatorcontrib><creatorcontrib>LOHMEIER FRANZ-JOSEF</creatorcontrib><creatorcontrib>ROTHER ANDRE</creatorcontrib><creatorcontrib>STAAB ULLRICH</creatorcontrib><creatorcontrib>KRESSBACH JENS</creatorcontrib><creatorcontrib>BRONNER ANDREAS</creatorcontrib><creatorcontrib>CIBA JOACHIM</creatorcontrib><creatorcontrib>PLEYER JURGEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANESCH PAUL</au><au>DI MARCO MIRKO</au><au>WIEGAND ALEXANDER</au><au>WILL ALEXANDER</au><au>LOHMEIER FRANZ-JOSEF</au><au>ROTHER ANDRE</au><au>STAAB ULLRICH</au><au>KRESSBACH JENS</au><au>BRONNER ANDREAS</au><au>CIBA JOACHIM</au><au>PLEYER JURGEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SENSOR FOR DETECTING PRESSURE AND/OR FILLING LEVEL AND/OR FLOW RATE AND/OR DENSITY AND/OR MASS AND/OR TEMPERATURE</title><date>2021-11-26</date><risdate>2021</risdate><abstract>The invention relates to a sensor (100) for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component (3) is coupled by nanowires (50) to other sensor components (2, 4, 9A, 9C, 20, 20B) and wherein the sensor components (2, 3, 4, 9A, 9C, 20, 20B) are fixed together, sealed or are in electric contact. For example, one sensor component (3) is connected directly to a circuit board via nanowires (50).
本发明涉及一种用于检测压力和/或料位和/或流量和/或密度和/或质量和/或温度的传感器(100)，其中传感器构件(3)借助于纳米线(50)与另外的传感器构件(2，4，9A，9C，20，20B)耦联，并且其中传感器构件(2，3，4，9A，9C，20，20B)相对于彼此固定、密封或电接触。例如，传感器构件(3)直接与电路板经由纳米线(50)连接。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING |
| title | SENSOR FOR DETECTING PRESSURE AND/OR FILLING LEVEL AND/OR FLOW RATE AND/OR DENSITY AND/OR MASS AND/OR TEMPERATURE |
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