Evaporation source device, vapor deposition device, and method for controlling evaporation source device
The invention relates to an evaporation source device, an evaporation device and a control method of the evaporation source device, and provides a technology capable of enabling the evaporation rate to be stable for a long time during evaporation. The evaporation source device is provided with a con...
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| creator | ICHIHARA MASAHIRO TAKEMI TAKASHI YAMADA NAOHITO |
| description | The invention relates to an evaporation source device, an evaporation device and a control method of the evaporation source device, and provides a technology capable of enabling the evaporation rate to be stable for a long time during evaporation. The evaporation source device is provided with a container in which an evaporation material is accommodated; a heating member which has a first heating portion which is for heating an upper region of the container including the discharge port for the vapor deposition material, and a second heating portion which is for heating a lower region of the container including the bottom portion; and a control member for controlling the heating output of the heating member, which is characterized in that the control member increases the heating output of the first heating portion at a second point in time following a first point in time during the vapor deposition period relative to the heating output of the first heating portion at the first point in time during the vapor de |
| format | Patent |
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The evaporation source device is provided with a container in which an evaporation material is accommodated; a heating member which has a first heating portion which is for heating an upper region of the container including the discharge port for the vapor deposition material, and a second heating portion which is for heating a lower region of the container including the bottom portion; and a control member for controlling the heating output of the heating member, which is characterized in that the control member increases the heating output of the first heating portion at a second point in time following a first point in time during the vapor deposition period relative to the heating output of the first heating portion at the first point in time during the vapor de</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211126&DB=EPODOC&CC=CN&NR=113699487A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25565,76548</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211126&DB=EPODOC&CC=CN&NR=113699487A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHIHARA MASAHIRO</creatorcontrib><creatorcontrib>TAKEMI TAKASHI</creatorcontrib><creatorcontrib>YAMADA NAOHITO</creatorcontrib><title>Evaporation source device, vapor deposition device, and method for controlling evaporation source device</title><description>The invention relates to an evaporation source device, an evaporation device and a control method of the evaporation source device, and provides a technology capable of enabling the evaporation rate to be stable for a long time during evaporation. The evaporation source device is provided with a container in which an evaporation material is accommodated; a heating member which has a first heating portion which is for heating an upper region of the container including the discharge port for the vapor deposition material, and a second heating portion which is for heating a lower region of the container including the bottom portion; and a control member for controlling the heating output of the heating member, which is characterized in that the control member increases the heating output of the first heating portion at a second point in time following a first point in time during the vapor deposition period relative to the heating output of the first heating portion at the first point in time during the vapor de</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMhwLUssyC9KLMnMz1Mozi8tSk5VSEkty0xO1VEAywB5BfnFmWB5mERiXopCbmpJRn6KQhpQRXJ-XklRfk5OZl66Qiou43gYWNMSc4pTeaE0N4Oim2uIs4cu0Pj41OKCxOTUvNSSeGc_Q0NjM0tLEwtzR2Ni1AAARnhA9Q</recordid><startdate>20211126</startdate><enddate>20211126</enddate><creator>ICHIHARA MASAHIRO</creator><creator>TAKEMI TAKASHI</creator><creator>YAMADA NAOHITO</creator><scope>EVB</scope></search><sort><creationdate>20211126</creationdate><title>Evaporation source device, vapor deposition device, and method for controlling evaporation source device</title><author>ICHIHARA MASAHIRO ; TAKEMI TAKASHI ; YAMADA NAOHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113699487A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ICHIHARA MASAHIRO</creatorcontrib><creatorcontrib>TAKEMI TAKASHI</creatorcontrib><creatorcontrib>YAMADA NAOHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ICHIHARA MASAHIRO</au><au>TAKEMI TAKASHI</au><au>YAMADA NAOHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Evaporation source device, vapor deposition device, and method for controlling evaporation source device</title><date>2021-11-26</date><risdate>2021</risdate><abstract>The invention relates to an evaporation source device, an evaporation device and a control method of the evaporation source device, and provides a technology capable of enabling the evaporation rate to be stable for a long time during evaporation. The evaporation source device is provided with a container in which an evaporation material is accommodated; a heating member which has a first heating portion which is for heating an upper region of the container including the discharge port for the vapor deposition material, and a second heating portion which is for heating a lower region of the container including the bottom portion; and a control member for controlling the heating output of the heating member, which is characterized in that the control member increases the heating output of the first heating portion at a second point in time following a first point in time during the vapor deposition period relative to the heating output of the first heating portion at the first point in time during the vapor de</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Evaporation source device, vapor deposition device, and method for controlling evaporation source device |
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