COMPOSITE COPPER MEMBER
An objective of the present invention is to provide a copper member comprising a novel composite surface treatment layer. The present invention provides a composite copper member comprising a metal layer formed from metal atoms other than copper on at least part of the surface of the copper member,...
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| creator | KOKAJI YOSHINOBU SATO MAKIKO |
| description | An objective of the present invention is to provide a copper member comprising a novel composite surface treatment layer. The present invention provides a composite copper member comprising a metal layer formed from metal atoms other than copper on at least part of the surface of the copper member, the member being characterized in that: the surface of the composite copper member on which the metal layer is formed comprises microscopic bumps; and, apart from the metal atoms, copper atoms and oxygen atoms are detected in any 10 nm-diameter range on the surface of the composite copper member by energy-dispersive X-ray analysis (EDX) using a transmission electron microscope (TEM).
本发明的目的在于提供一种具有新型的复合表面处理层的铜部件。通过本发明提供一种复合铜部件，其是在铜部件的至少一部分表面形成有包括除铜以外的金属原子的金属层的复合铜部件，其特征在于，形成有上述金属层的上述复合铜部件的表面具有微细的凸部，利用使用透射式电子显微镜(TEM)的能量色散X射线分析法(EDX)时，在上述复合铜部件的上述表面的任意的直径10nm的范围内，除上述金属原子以外，均检测到铜原子和氧原子。 |
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本发明的目的在于提供一种具有新型的复合表面处理层的铜部件。通过本发明提供一种复合铜部件，其是在铜部件的至少一部分表面形成有包括除铜以外的金属原子的金属层的复合铜部件，其特征在于，形成有上述金属层的上述复合铜部件的表面具有微细的凸部，利用使用透射式电子显微镜(TEM)的能量色散X射线分析法(EDX)时，在上述复合铜部件的上述表面的任意的直径10nm的范围内，除上述金属原子以外，均检测到铜原子和氧原子。</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211116&DB=EPODOC&CC=CN&NR=113661275A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211116&DB=EPODOC&CC=CN&NR=113661275A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOKAJI YOSHINOBU</creatorcontrib><creatorcontrib>SATO MAKIKO</creatorcontrib><title>COMPOSITE COPPER MEMBER</title><description>An objective of the present invention is to provide a copper member comprising a novel composite surface treatment layer. The present invention provides a composite copper member comprising a metal layer formed from metal atoms other than copper on at least part of the surface of the copper member, the member being characterized in that: the surface of the composite copper member on which the metal layer is formed comprises microscopic bumps; and, apart from the metal atoms, copper atoms and oxygen atoms are detected in any 10 nm-diameter range on the surface of the composite copper member by energy-dispersive X-ray analysis (EDX) using a transmission electron microscope (TEM).
本发明的目的在于提供一种具有新型的复合表面处理层的铜部件。通过本发明提供一种复合铜部件，其是在铜部件的至少一部分表面形成有包括除铜以外的金属原子的金属层的复合铜部件，其特征在于，形成有上述金属层的上述复合铜部件的表面具有微细的凸部，利用使用透射式电子显微镜(TEM)的能量色散X射线分析法(EDX)时，在上述复合铜部件的上述表面的任意的直径10nm的范围内，除上述金属原子以外，均检测到铜原子和氧原子。</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB39vcN8A_2DHFVcPYPCHANUvB19XVyDeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGxmZmhkbmpo7GxKgBANf6H3I</recordid><startdate>20211116</startdate><enddate>20211116</enddate><creator>KOKAJI YOSHINOBU</creator><creator>SATO MAKIKO</creator><scope>EVB</scope></search><sort><creationdate>20211116</creationdate><title>COMPOSITE COPPER MEMBER</title><author>KOKAJI YOSHINOBU ; SATO MAKIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113661275A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KOKAJI YOSHINOBU</creatorcontrib><creatorcontrib>SATO MAKIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOKAJI YOSHINOBU</au><au>SATO MAKIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITE COPPER MEMBER</title><date>2021-11-16</date><risdate>2021</risdate><abstract>An objective of the present invention is to provide a copper member comprising a novel composite surface treatment layer. The present invention provides a composite copper member comprising a metal layer formed from metal atoms other than copper on at least part of the surface of the copper member, the member being characterized in that: the surface of the composite copper member on which the metal layer is formed comprises microscopic bumps; and, apart from the metal atoms, copper atoms and oxygen atoms are detected in any 10 nm-diameter range on the surface of the composite copper member by energy-dispersive X-ray analysis (EDX) using a transmission electron microscope (TEM).
本发明的目的在于提供一种具有新型的复合表面处理层的铜部件。通过本发明提供一种复合铜部件，其是在铜部件的至少一部分表面形成有包括除铜以外的金属原子的金属层的复合铜部件，其特征在于，形成有上述金属层的上述复合铜部件的表面具有微细的凸部，利用使用透射式电子显微镜(TEM)的能量色散X射线分析法(EDX)时，在上述复合铜部件的上述表面的任意的直径10nm的范围内，除上述金属原子以外，均检测到铜原子和氧原子。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING |
| title | COMPOSITE COPPER MEMBER |
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