Power module

Power module

The invention provides a power module. The power module comprises a substrate and a bonding assembly, and the bonding assembly comprises a plurality of chips, bonding parts and terminals; the plurality of chips are arranged on the substrate and are electrically connected with the substrate; the bond...

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Hauptverfasser: LIANG YONGHU, CAI MIAO, YUN MINGHUI, SONG LEI, YANG DAOGUO, GAO YONGJIE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIANG YONGHU
CAI MIAO
YUN MINGHUI
SONG LEI
YANG DAOGUO
GAO YONGJIE
description The invention provides a power module. The power module comprises a substrate and a bonding assembly, and the bonding assembly comprises a plurality of chips, bonding parts and terminals; the plurality of chips are arranged on the substrate and are electrically connected with the substrate; the bonding part is respectively connected with the plurality of chips; and the terminal is electrically connected with the bonding part. According to the power module provided by the invention, in the working process of the power module, the current flows to the plurality of chips through the bonding parts after passing through the terminals, and the plurality of chips are connected in parallel, so that the current density distribution is uniform, the heating value of the power device is reduced, and the influence of the heating of the power module on the performance of the power module is further reduced; while improving the quality of the power module, the probability that the power module is damaged due to heating is r
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Power module
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